Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1614-T-R

    APH-1614-T-R

    APH-1614-T-R

    Samtec Inc.

    4,302
    RFQ

    -

    APH-1614-T-R * - Active - - - - - - - - - - - - - - -
    APH-0908-G-T

    APH-0908-G-T

    APH-0908-G-T

    Samtec Inc.

    4,998
    RFQ

    -

    APH-0908-G-T * - Active - - - - - - - - - - - - - - -
    APH-1214-T-R

    APH-1214-T-R

    APH-1214-T-R

    Samtec Inc.

    4,088
    RFQ

    -

    APH-1214-T-R * - Active - - - - - - - - - - - - - - -
    APH-0814-T-R

    APH-0814-T-R

    APH-0814-T-R

    Samtec Inc.

    3,446
    RFQ

    -

    APH-0814-T-R * - Active - - - - - - - - - - - - - - -
    APH-0708-G-T

    APH-0708-G-T

    APH-0708-G-T

    Samtec Inc.

    2,966
    RFQ

    -

    APH-0708-G-T * - Active - - - - - - - - - - - - - - -
    16-810-90

    16-810-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,491
    RFQ
    16-810-90

    Datasheet

    16-810-90 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    13-7450-10

    13-7450-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    4,553
    RFQ
    13-7450-10

    Datasheet

    13-7450-10 700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-7970-10

    13-7970-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    4,297
    RFQ
    13-7970-10

    Datasheet

    13-7970-10 700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-3513-11

    38-3513-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,826
    RFQ
    38-3513-11

    Datasheet

    38-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0503-21

    15-0503-21

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,238
    RFQ
    15-0503-21

    Datasheet

    15-0503-21 0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    15-0503-31

    15-0503-31

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,711
    RFQ
    15-0503-31

    Datasheet

    15-0503-31 0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0508-20

    22-0508-20

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,842
    RFQ
    22-0508-20

    Datasheet

    22-0508-20 508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    22-0508-30

    22-0508-30

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,076
    RFQ
    22-0508-30

    Datasheet

    22-0508-30 508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    22-1508-30

    22-1508-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,854
    RFQ
    22-1508-30

    Datasheet

    22-1508-30 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    510-83-181-17-001101

    510-83-181-17-001101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,046
    RFQ
    510-83-181-17-001101

    Datasheet

    510-83-181-17-001101 510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-17-082101

    510-83-181-17-082101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    3,664
    RFQ
    510-83-181-17-082101

    Datasheet

    510-83-181-17-082101 510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-14-031101

    510-83-181-14-031101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,183
    RFQ
    510-83-181-14-031101

    Datasheet

    510-83-181-14-031101 510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-181-15-001101

    510-83-181-15-001101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,925
    RFQ
    510-83-181-15-001101

    Datasheet

    510-83-181-15-001101 510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0501-20

    18-0501-20

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    4,077
    RFQ
    18-0501-20

    Datasheet

    18-0501-20 501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-0501-30

    18-0501-30

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    3,609
    RFQ
    18-0501-30

    Datasheet

    18-0501-30 501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 423424425426427428429430...955Next»
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