Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    PGA175H010B5-1620R

    PGA175H010B5-1620R

    PGA SOCKET 175 CTS

    Amphenol ICC (FCI)

    3,865
    RFQ
    PGA175H010B5-1620R

    Datasheet

    PGA175H010B5-1620R - - Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    APO-318-T-T

    APO-318-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,744
    RFQ

    -

    APO-318-T-T * - Active - - - - - - - - - - - - - - -
    20-8865-310C

    20-8865-310C

    CONN ELEVATOR SOCKET 20 PO .300

    Aries Electronics

    2,125
    RFQ

    -

    20-8865-310C 8 - Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-83-632-10-002101

    299-83-632-10-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,389
    RFQ
    299-83-632-10-002101

    Datasheet

    299-83-632-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-10E

    28-3518-10E

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,574
    RFQ
    28-3518-10E

    Datasheet

    28-3518-10E 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-6820-90

    18-6820-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,702
    RFQ
    18-6820-90

    Datasheet

    18-6820-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICO-632-NGT

    ICO-632-NGT

    CONN IC DIP SOCKET 32POS GOLD

    Samtec Inc.

    2,787
    RFQ
    ICO-632-NGT

    Datasheet

    ICO-632-NGT ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-139-41-013000

    346-93-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    3,830
    RFQ
    346-93-139-41-013000

    Datasheet

    346-93-139-41-013000 346 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-139-41-013000

    346-43-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    2,788
    RFQ
    346-43-139-41-013000

    Datasheet

    346-43-139-41-013000 346 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0503-30

    24-0503-30

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,450
    RFQ
    24-0503-30

    Datasheet

    24-0503-30 0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-3508-302

    20-3508-302

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,886
    RFQ
    20-3508-302

    Datasheet

    20-3508-302 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-202

    14-3508-202

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,079
    RFQ
    14-3508-202

    Datasheet

    14-3508-202 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-302

    14-3508-302

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,741
    RFQ
    14-3508-302

    Datasheet

    14-3508-302 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-318-G-A

    APO-318-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,465
    RFQ
    APO-318-G-A

    Datasheet

    APO-318-G-A APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-324-MGG

    ICO-324-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,103
    RFQ
    ICO-324-MGG

    Datasheet

    ICO-324-MGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-93-624-10-002000

    299-93-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    3,120
    RFQ
    299-93-624-10-002000

    Datasheet

    299-93-624-10-002000 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-624-10-002000

    299-43-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,288
    RFQ
    299-43-624-10-002000

    Datasheet

    299-43-624-10-002000 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0311-T-11

    HLS-0311-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,082
    RFQ
    HLS-0311-T-11

    Datasheet

    HLS-0311-T-11 HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    32-6501-20

    32-6501-20

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    2,549
    RFQ
    32-6501-20

    Datasheet

    32-6501-20 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6501-30

    32-6501-30

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    4,494
    RFQ
    32-6501-30

    Datasheet

    32-6501-30 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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