Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0212-T-H

    APH-0212-T-H

    APH-0212-T-H

    Samtec Inc.

    3,682
    RFQ

    -

    APH-0212-T-H * - Active - - - - - - - - - - - - - - -
    APH-0312-T-H

    APH-0312-T-H

    APH-0312-T-H

    Samtec Inc.

    4,810
    RFQ

    -

    APH-0312-T-H * - Active - - - - - - - - - - - - - - -
    APH-1312-T-H

    APH-1312-T-H

    APH-1312-T-H

    Samtec Inc.

    2,007
    RFQ

    -

    APH-1312-T-H * - Active - - - - - - - - - - - - - - -
    APH-1212-T-H

    APH-1212-T-H

    APH-1212-T-H

    Samtec Inc.

    2,600
    RFQ

    -

    APH-1212-T-H * - Active - - - - - - - - - - - - - - -
    ICA-422-ZHGT

    ICA-422-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,978
    RFQ
    ICA-422-ZHGT

    Datasheet

    ICA-422-ZHGT ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    18-81000-310C

    18-81000-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,093
    RFQ
    18-81000-310C

    Datasheet

    18-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-81250-310C

    18-81250-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,530
    RFQ
    18-81250-310C

    Datasheet

    18-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8250-310C

    18-8250-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,372
    RFQ
    18-8250-310C

    Datasheet

    18-8250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8300-310C

    18-8300-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,270
    RFQ
    18-8300-310C

    Datasheet

    18-8300-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8375-310C

    18-8375-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,232
    RFQ
    18-8375-310C

    Datasheet

    18-8375-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8400-310C

    18-8400-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,348
    RFQ
    18-8400-310C

    Datasheet

    18-8400-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8406-310C

    18-8406-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,046
    RFQ
    18-8406-310C

    Datasheet

    18-8406-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8500-310C

    18-8500-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,185
    RFQ
    18-8500-310C

    Datasheet

    18-8500-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8545-310C

    18-8545-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,786
    RFQ
    18-8545-310C

    Datasheet

    18-8545-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8600-310C

    18-8600-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,380
    RFQ
    18-8600-310C

    Datasheet

    18-8600-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8670-310C

    18-8670-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,538
    RFQ
    18-8670-310C

    Datasheet

    18-8670-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-8750-310C

    18-8750-310C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,551
    RFQ
    18-8750-310C

    Datasheet

    18-8750-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APA-316-G-M

    APA-316-G-M

    ADAPTER PLUG

    Samtec Inc.

    3,138
    RFQ
    APA-316-G-M

    Datasheet

    APA-316-G-M APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    14-0501-20

    14-0501-20

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    3,039
    RFQ
    14-0501-20

    Datasheet

    14-0501-20 501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-0501-30

    14-0501-30

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    3,781
    RFQ
    14-0501-30

    Datasheet

    14-0501-30 501 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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