Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    17-0508-21

    17-0508-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,419
    RFQ
    17-0508-21

    Datasheet

    17-0508-21 508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    17-0508-31

    17-0508-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,452
    RFQ
    17-0508-31

    Datasheet

    17-0508-31 508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    110-41-308-41-105000

    110-41-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,006
    RFQ
    110-41-308-41-105000

    Datasheet

    110-41-308-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-308-41-105000

    110-91-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,670
    RFQ
    110-91-308-41-105000

    Datasheet

    110-91-308-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    09-0511-11

    09-0511-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    4,336
    RFQ
    09-0511-11

    Datasheet

    09-0511-11 511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0214-G-2

    HLS-0214-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,669
    RFQ
    HLS-0214-G-2

    Datasheet

    HLS-0214-G-2 HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    19-71080-10

    19-71080-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    4,335
    RFQ
    19-71080-10

    Datasheet

    19-71080-10 700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7375-10

    19-7375-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,673
    RFQ
    19-7375-10

    Datasheet

    19-7375-10 700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7400-10

    19-7400-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    4,354
    RFQ
    19-7400-10

    Datasheet

    19-7400-10 700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7650-10

    19-7650-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,754
    RFQ
    19-7650-10

    Datasheet

    19-7650-10 700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7750-10

    19-7750-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    4,704
    RFQ
    19-7750-10

    Datasheet

    19-7750-10 700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81000-310C

    20-81000-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,264
    RFQ
    20-81000-310C

    Datasheet

    20-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81156-310C

    20-81156-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,205
    RFQ
    20-81156-310C

    Datasheet

    20-81156-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81200-310C

    20-81200-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,232
    RFQ
    20-81200-310C

    Datasheet

    20-81200-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81250-310C

    20-81250-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,545
    RFQ
    20-81250-310C

    Datasheet

    20-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8190-310C

    20-8190-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,030
    RFQ
    20-8190-310C

    Datasheet

    20-8190-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8240-310C

    20-8240-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,516
    RFQ
    20-8240-310C

    Datasheet

    20-8240-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8260-310C

    20-8260-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,492
    RFQ
    20-8260-310C

    Datasheet

    20-8260-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8280-310C

    20-8280-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,909
    RFQ
    20-8280-310C

    Datasheet

    20-8280-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8300-310C

    20-8300-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,071
    RFQ
    20-8300-310C

    Datasheet

    20-8300-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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