Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-47-320-41-105000

    110-47-320-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,165
    RFQ
    110-47-320-41-105000

    Datasheet

    110-47-320-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-420-41-105000

    110-47-420-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,958
    RFQ
    110-47-420-41-105000

    Datasheet

    110-47-420-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-0508-21

    18-0508-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,293
    RFQ
    18-0508-21

    Datasheet

    18-0508-21 508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    18-0508-31

    18-0508-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,593
    RFQ
    18-0508-31

    Datasheet

    18-0508-31 508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    110-41-314-41-105000

    110-41-314-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,083
    RFQ
    110-41-314-41-105000

    Datasheet

    110-41-314-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-314-41-105000

    110-91-314-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,639
    RFQ
    110-91-314-41-105000

    Datasheet

    110-91-314-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-314-41-117000

    114-41-314-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,945
    RFQ
    114-41-314-41-117000

    Datasheet

    114-41-314-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-314-41-117000

    114-91-314-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,808
    RFQ
    114-91-314-41-117000

    Datasheet

    114-91-314-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-428-41-001000

    110-99-428-41-001000

    CONN IC DIP SOCKET 28POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,208
    RFQ
    110-99-428-41-001000

    Datasheet

    110-99-428-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-105-41-005000

    317-93-105-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,615
    RFQ
    317-93-105-41-005000

    Datasheet

    317-93-105-41-005000 317 Tube Active SIP 5 (1 x 5) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-652-41-013101

    116-87-652-41-013101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,450
    RFQ
    116-87-652-41-013101

    Datasheet

    116-87-652-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-4508-30

    20-4508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,405
    RFQ
    20-4508-30

    Datasheet

    20-4508-30 508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-316-G-C

    APO-316-G-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,675
    RFQ
    APO-316-G-C

    Datasheet

    APO-316-G-C APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    0479890112

    0479890112

    CONN SOCKET PGA 989POS GOLD

    Molex

    4,160
    RFQ
    0479890112

    Datasheet

    0479890112 47989 Tray Obsolete PGA 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - - Liquid Crystal Polymer (LCP) -
    APA-314-G-P

    APA-314-G-P

    ADAPTER PLUG

    Samtec Inc.

    4,775
    RFQ
    APA-314-G-P

    Datasheet

    APA-314-G-P APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    115-41-318-41-001000

    115-41-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,399
    RFQ
    115-41-318-41-001000

    Datasheet

    115-41-318-41-001000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-318-41-001000

    115-91-318-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    3,667
    RFQ
    115-91-318-41-001000

    Datasheet

    115-91-318-41-001000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-306-41-002000

    126-41-306-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,138
    RFQ
    126-41-306-41-002000

    Datasheet

    126-41-306-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-306-41-002000

    126-91-306-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,690
    RFQ
    126-91-306-41-002000

    Datasheet

    126-91-306-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-1508-21

    18-1508-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,037
    RFQ
    18-1508-21

    Datasheet

    18-1508-21 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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