Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-91-314-41-006000

    116-91-314-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,629
    RFQ
    116-91-314-41-006000

    Datasheet

    116-91-314-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-47-632-41-001000

    210-47-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,252
    RFQ
    210-47-632-41-001000

    Datasheet

    210-47-632-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-108-41-005000

    917-41-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    3,372
    RFQ
    917-41-108-41-005000

    Datasheet

    917-41-108-41-005000 917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-208-41-005000

    917-41-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,107
    RFQ
    917-41-208-41-005000

    Datasheet

    917-41-208-41-005000 917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-108-41-005000

    917-91-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,418
    RFQ
    917-91-108-41-005000

    Datasheet

    917-91-108-41-005000 917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-208-41-005000

    917-91-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,768
    RFQ
    917-91-208-41-005000

    Datasheet

    917-91-208-41-005000 917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-109-41-005000

    317-43-109-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    2,589
    RFQ
    317-43-109-41-005000

    Datasheet

    317-43-109-41-005000 317 Bulk Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-0508-20

    36-0508-20

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    2,639
    RFQ
    36-0508-20

    Datasheet

    36-0508-20 508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-0508-30

    36-0508-30

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    3,426
    RFQ
    36-0508-30

    Datasheet

    36-0508-30 508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-1508-20

    36-1508-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,214
    RFQ
    36-1508-20

    Datasheet

    36-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    612-93-306-41-001000

    612-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,794
    RFQ
    612-93-306-41-001000

    Datasheet

    612-93-306-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-306-41-001000

    612-43-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,327
    RFQ
    612-43-306-41-001000

    Datasheet

    612-43-306-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-310-41-001000

    116-47-310-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,252
    RFQ
    116-47-310-41-001000

    Datasheet

    116-47-310-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-322-41-003000

    115-91-322-41-003000

    SOCKET IC OPEN LOWPRO .300 22POS

    Mill-Max Manufacturing Corp.

    3,279
    RFQ

    -

    115-91-322-41-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-322-41-003000

    115-41-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,641
    RFQ
    115-41-322-41-003000

    Datasheet

    115-41-322-41-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-322-41-117000

    114-47-322-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,367
    RFQ
    114-47-322-41-117000

    Datasheet

    114-47-322-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-422-41-117000

    114-47-422-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,911
    RFQ
    114-47-422-41-117000

    Datasheet

    114-47-422-41-117000 114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-6501-21

    18-6501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,459
    RFQ
    18-6501-21

    Datasheet

    18-6501-21 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-6501-31

    18-6501-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,558
    RFQ
    18-6501-31

    Datasheet

    18-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6823-90T

    28-6823-90T

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    2,415
    RFQ
    28-6823-90T

    Datasheet

    28-6823-90T Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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