Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-13-424-41-001000

    110-13-424-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,109
    RFQ
    110-13-424-41-001000

    Datasheet

    110-13-424-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-41-648-41-001000

    115-41-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,745
    RFQ
    115-41-648-41-001000

    Datasheet

    115-41-648-41-001000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-648-41-001000

    115-91-648-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    3,402
    RFQ
    115-91-648-41-001000

    Datasheet

    115-91-648-41-001000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-314-41-003000

    612-43-314-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,774
    RFQ
    612-43-314-41-003000

    Datasheet

    612-43-314-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-314-41-003000

    612-93-314-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,664
    RFQ
    612-93-314-41-003000

    Datasheet

    612-93-314-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-0511-11

    20-0511-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    4,998
    RFQ
    20-0511-11

    Datasheet

    20-0511-11 511 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    48-6513-11H

    48-6513-11H

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,998
    RFQ
    48-6513-11H

    Datasheet

    48-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    546-87-144-13-041135

    546-87-144-13-041135

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    3,997
    RFQ
    546-87-144-13-041135

    Datasheet

    546-87-144-13-041135 546 Bulk Active PGA 144 (13 x 13) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-144-13-041136

    546-87-144-13-041136

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,989
    RFQ
    546-87-144-13-041136

    Datasheet

    546-87-144-13-041136 546 Bulk Active PGA 144 (13 x 13) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0316-T-22-L

    HLS-0316-T-22-L

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,955
    RFQ
    HLS-0316-T-22-L

    Datasheet

    HLS-0316-T-22-L HLS Tube Active SIP 48 (3 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-632-WGG-2

    ICA-632-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,810
    RFQ
    ICA-632-WGG-2

    Datasheet

    ICA-632-WGG-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-93-420-31-012000

    614-93-420-31-012000

    SOCKET CARRIER LOWPRO .400 20POS

    Mill-Max Manufacturing Corp.

    3,184
    RFQ
    614-93-420-31-012000

    Datasheet

    614-93-420-31-012000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-420-31-012000

    614-43-420-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,492
    RFQ
    614-43-420-31-012000

    Datasheet

    614-43-420-31-012000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-640-41-117000

    114-91-640-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,903
    RFQ
    114-91-640-41-117000

    Datasheet

    114-91-640-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-WGT-2

    ICA-640-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,041
    RFQ
    ICA-640-WGT-2

    Datasheet

    ICA-640-WGT-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    126-41-314-41-003000

    126-41-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,496
    RFQ
    126-41-314-41-003000

    Datasheet

    126-41-314-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-314-41-003000

    126-91-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,357
    RFQ
    126-91-314-41-003000

    Datasheet

    126-91-314-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-3503-21

    20-3503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,296
    RFQ
    20-3503-21

    Datasheet

    20-3503-21 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3503-31

    20-3503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,409
    RFQ
    20-3503-31

    Datasheet

    20-3503-31 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6508-20

    32-6508-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,158
    RFQ
    32-6508-20

    Datasheet

    32-6508-20 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 581582583584585586587588...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER