Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    12-6810-90C

    12-6810-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    45
    RFQ
    12-6810-90C

    Datasheet

    12-6810-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-640-T-B

    APA-640-T-B

    ADAPTER PLUG

    Samtec Inc.

    100
    RFQ
    APA-640-T-B

    Datasheet

    APA-640-T-B APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-640-G-A1

    APA-640-G-A1

    ADAPTER PLUG

    Samtec Inc.

    98
    RFQ
    APA-640-G-A1

    Datasheet

    APA-640-G-A1 APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    28-823-90C

    28-823-90C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    7
    RFQ
    28-823-90C

    Datasheet

    28-823-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-93-628-10-002000

    299-93-628-10-002000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    56
    RFQ
    299-93-628-10-002000

    Datasheet

    299-93-628-10-002000 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-640-41-801000

    110-13-640-41-801000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    30
    RFQ
    110-13-640-41-801000

    Datasheet

    110-13-640-41-801000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-316-G-P

    APA-316-G-P

    ADAPTER PLUG

    Samtec Inc.

    26
    RFQ
    APA-316-G-P

    Datasheet

    APA-316-G-P APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-516-11

    40-516-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    20
    RFQ
    40-516-11

    Datasheet

    40-516-11 516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-13-324-41-801000

    110-13-324-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    55
    RFQ
    110-13-324-41-801000

    Datasheet

    110-13-324-41-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    209-PGM17020-10

    209-PGM17020-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    8
    RFQ
    209-PGM17020-10

    Datasheet

    209-PGM17020-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    2-2129710-8

    2-2129710-8

    CONN SOCKET LGA 3647POS GOLD

    TE Connectivity AMP Connectors

    34
    RFQ
    2-2129710-8

    Datasheet

    2-2129710-8 - Tray Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
    256-1292-00-0602J

    256-1292-00-0602J

    CONN IC DIP SOCKET ZIF 56POS GLD

    3M

    13
    RFQ
    256-1292-00-0602J

    Datasheet

    256-1292-00-0602J Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    260-4204-01

    260-4204-01

    CONN SOCKET QFN 60POS GOLD

    3M

    14
    RFQ
    260-4204-01

    Datasheet

    260-4204-01 Textool™ Bulk Active QFN 60 (4 x 15) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    ICO-314-STT

    ICO-314-STT

    CONN IC DIP SOCKET 14POS TIN

    Samtec Inc.

    68
    RFQ
    ICO-314-STT

    Datasheet

    ICO-314-STT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    123-83-314-41-001101

    123-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    30
    RFQ
    123-83-314-41-001101

    Datasheet

    123-83-314-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4590

    4590

    CONN TRANSIST TO-5 3POS TIN

    Keystone Electronics

    58
    RFQ
    4590

    Datasheet

    4590 - Bulk Active Transistor, TO-5 3 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    APA-314-T-A1

    APA-314-T-A1

    ADAPTER PLUG

    Samtec Inc.

    98
    RFQ
    APA-314-T-A1

    Datasheet

    APA-314-T-A1 APA Bulk Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    299-83-308-10-001101

    299-83-308-10-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    47
    RFQ
    299-83-308-10-001101

    Datasheet

    299-83-308-10-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-MTT

    ICO-320-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    66
    RFQ
    ICO-320-MTT

    Datasheet

    ICO-320-MTT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    XR2C-2015

    XR2C-2015

    CONN SOCKET SIP 20POS GOLD

    Omron Electronics Inc-EMC Div

    43
    RFQ
    XR2C-2015

    Datasheet

    XR2C-2015 XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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