Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-93-328-41-003000

    116-93-328-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,239
    RFQ
    116-93-328-41-003000

    Datasheet

    116-93-328-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-428-41-003000

    116-93-428-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,110
    RFQ
    116-93-428-41-003000

    Datasheet

    116-93-428-41-003000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-628-41-003000

    116-93-628-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,829
    RFQ
    116-93-628-41-003000

    Datasheet

    116-93-628-41-003000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-328-41-003000

    116-43-328-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,821
    RFQ
    116-43-328-41-003000

    Datasheet

    116-43-328-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-428-41-003000

    116-43-428-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,617
    RFQ
    116-43-428-41-003000

    Datasheet

    116-43-428-41-003000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6820-90C

    38-6820-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,620
    RFQ
    38-6820-90C

    Datasheet

    38-6820-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-6822-90C

    38-6822-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,250
    RFQ
    38-6822-90C

    Datasheet

    38-6822-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-6823-90C

    38-6823-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,390
    RFQ
    38-6823-90C

    Datasheet

    38-6823-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    714-43-150-31-018000

    714-43-150-31-018000

    CONN SOCKET SIP 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,199
    RFQ
    714-43-150-31-018000

    Datasheet

    714-43-150-31-018000 714 Bulk Active SIP 50 (1 x 50) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-314-G-H

    APO-314-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,825
    RFQ
    APO-314-G-H

    Datasheet

    APO-314-G-H APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-318-41-002000

    126-93-318-41-002000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    3,531
    RFQ
    126-93-318-41-002000

    Datasheet

    126-93-318-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-318-41-002000

    126-43-318-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,178
    RFQ
    126-43-318-41-002000

    Datasheet

    126-43-318-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-640-STL-O

    ICF-640-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,297
    RFQ
    ICF-640-STL-O

    Datasheet

    ICF-640-STL-O ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-640-STL-I

    ICF-640-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,951
    RFQ
    ICF-640-STL-I

    Datasheet

    ICF-640-STL-I ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-324-G-M

    APA-324-G-M

    ADAPTER PLUG

    Samtec Inc.

    2,865
    RFQ
    APA-324-G-M

    Datasheet

    APA-324-G-M APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-624-G-M

    APA-624-G-M

    ADAPTER PLUG

    Samtec Inc.

    3,468
    RFQ
    APA-624-G-M

    Datasheet

    APA-624-G-M APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    14-3508-212

    14-3508-212

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,749
    RFQ
    14-3508-212

    Datasheet

    14-3508-212 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-3508-312

    14-3508-312

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,342
    RFQ
    14-3508-312

    Datasheet

    14-3508-312 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-648-ZSGG

    ICA-648-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,460
    RFQ
    ICA-648-ZSGG

    Datasheet

    ICA-648-ZSGG ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-11-636-41-001000

    110-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,275
    RFQ
    110-11-636-41-001000

    Datasheet

    110-11-636-41-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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