Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1610-G-R

    APH-1610-G-R

    APH-1610-G-R

    Samtec Inc.

    4,901
    RFQ

    -

    APH-1610-G-R * - Active - - - - - - - - - - - - - - -
    APH-1410-G-R

    APH-1410-G-R

    APH-1410-G-R

    Samtec Inc.

    4,882
    RFQ

    -

    APH-1410-G-R * - Active - - - - - - - - - - - - - - -
    APH-1710-G-R

    APH-1710-G-R

    APH-1710-G-R

    Samtec Inc.

    4,707
    RFQ

    -

    APH-1710-G-R * - Active - - - - - - - - - - - - - - -
    28-6823-90

    28-6823-90

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,888
    RFQ
    28-6823-90

    Datasheet

    28-6823-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    30-0501-30

    30-0501-30

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    3,320
    RFQ
    30-0501-30

    Datasheet

    30-0501-30 501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6508-302

    32-6508-302

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,937
    RFQ
    32-6508-302

    Datasheet

    32-6508-302 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-100-10-000112

    614-83-100-10-000112

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    2,722
    RFQ
    614-83-100-10-000112

    Datasheet

    614-83-100-10-000112 614 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-6621-30

    26-6621-30

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    2,797
    RFQ
    26-6621-30

    Datasheet

    26-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-328-41-001000

    126-41-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,822
    RFQ
    126-41-328-41-001000

    Datasheet

    126-41-328-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-428-41-001000

    126-41-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,720
    RFQ
    126-41-428-41-001000

    Datasheet

    126-41-428-41-001000 126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-628-41-001000

    126-41-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,133
    RFQ
    126-41-628-41-001000

    Datasheet

    126-41-628-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-328-41-001000

    126-91-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,506
    RFQ
    126-91-328-41-001000

    Datasheet

    126-91-328-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-428-41-001000

    126-91-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,129
    RFQ
    126-91-428-41-001000

    Datasheet

    126-91-428-41-001000 126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-628-41-001000

    126-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,127
    RFQ
    126-91-628-41-001000

    Datasheet

    126-91-628-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-652-41-105000

    110-41-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,248
    RFQ
    110-41-652-41-105000

    Datasheet

    110-41-652-41-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-952-41-105000

    110-41-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,858
    RFQ
    110-41-952-41-105000

    Datasheet

    110-41-952-41-105000 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-652-41-105000

    110-91-652-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,548
    RFQ
    110-91-652-41-105000

    Datasheet

    110-91-652-41-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-952-41-105000

    110-91-952-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,163
    RFQ
    110-91-952-41-105000

    Datasheet

    110-91-952-41-105000 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-084-13-081101

    550-10-084-13-081101

    PGA SOLDER TAIL

    Preci-Dip

    4,170
    RFQ
    550-10-084-13-081101

    Datasheet

    550-10-084-13-081101 550 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-93-316-41-002000

    124-93-316-41-002000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,362
    RFQ
    124-93-316-41-002000

    Datasheet

    124-93-316-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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