Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    612-43-322-41-001000

    612-43-322-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,671
    RFQ
    612-43-322-41-001000

    Datasheet

    612-43-322-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-422-41-001000

    612-43-422-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,306
    RFQ
    612-43-422-41-001000

    Datasheet

    612-43-422-41-001000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-650-41-006000

    116-47-650-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,520
    RFQ
    116-47-650-41-006000

    Datasheet

    116-47-650-41-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-642-41-117000

    114-93-642-41-117000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    2,684
    RFQ
    114-93-642-41-117000

    Datasheet

    114-93-642-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-642-41-117000

    114-43-642-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,855
    RFQ
    114-43-642-41-117000

    Datasheet

    114-43-642-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-6554-10

    42-6554-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,226
    RFQ
    42-6554-10

    Datasheet

    42-6554-10 55 Tray Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3552-10

    42-3552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,563
    RFQ
    42-3552-10

    Datasheet

    42-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3553-10

    42-3553-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,135
    RFQ
    42-3553-10

    Datasheet

    42-3553-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6552-10

    42-6552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,987
    RFQ
    42-6552-10

    Datasheet

    42-6552-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6553-10

    42-6553-10

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    4,534
    RFQ
    42-6553-10

    Datasheet

    42-6553-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    108-PGM12005-10

    108-PGM12005-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,707
    RFQ
    108-PGM12005-10

    Datasheet

    108-PGM12005-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6503-21

    22-6503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,930
    RFQ
    22-6503-21

    Datasheet

    22-6503-21 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    22-6503-31

    22-6503-31

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,530
    RFQ
    22-6503-31

    Datasheet

    22-6503-31 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-13-432-41-001000

    110-13-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,859
    RFQ
    110-13-432-41-001000

    Datasheet

    110-13-432-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-83-101-13-061112

    614-83-101-13-061112

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    3,708
    RFQ
    614-83-101-13-061112

    Datasheet

    614-83-101-13-061112 614 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-422-T-R

    APO-422-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,963
    RFQ

    -

    APO-422-T-R * - Active - - - - - - - - - - - - - - -
    117-41-648-41-005000

    117-41-648-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,692
    RFQ
    117-41-648-41-005000

    Datasheet

    117-41-648-41-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-91-648-41-005000

    117-91-648-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,569
    RFQ
    117-91-648-41-005000

    Datasheet

    117-91-648-41-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-322-41-801000

    110-93-322-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    2,769
    RFQ
    110-93-322-41-801000

    Datasheet

    110-93-322-41-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-322-41-801000

    110-43-322-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,139
    RFQ
    110-43-322-41-801000

    Datasheet

    110-43-322-41-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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