Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    HLS-0317-G-2

    HLS-0317-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,141
    RFQ
    HLS-0317-G-2

    Datasheet

    HLS-0317-G-2 HLS Tube Active SIP 51 (3 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-47-642-41-007000

    116-47-642-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,882
    RFQ
    116-47-642-41-007000

    Datasheet

    116-47-642-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-432-11-480000

    605-41-432-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,988
    RFQ
    605-41-432-11-480000

    Datasheet

    605-41-432-11-480000 605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-632-11-480000

    605-41-632-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,293
    RFQ
    605-41-632-11-480000

    Datasheet

    605-41-632-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-432-11-480000

    605-91-432-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,504
    RFQ
    605-91-432-11-480000

    Datasheet

    605-91-432-11-480000 605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-632-11-480000

    605-91-632-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,636
    RFQ
    605-91-632-11-480000

    Datasheet

    605-91-632-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-G-T

    APO-320-G-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,672
    RFQ
    APO-320-G-T

    Datasheet

    APO-320-G-T APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    36-3551-10

    36-3551-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,450
    RFQ
    36-3551-10

    Datasheet

    36-3551-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3553-10

    36-3553-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,236
    RFQ
    36-3553-10

    Datasheet

    36-3553-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-10

    36-6551-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,830
    RFQ
    36-6551-10

    Datasheet

    36-6551-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6552-10

    36-6552-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,440
    RFQ
    36-6552-10

    Datasheet

    36-6552-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6553-10

    36-6553-10

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    4,707
    RFQ
    36-6553-10

    Datasheet

    36-6553-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3552-10

    36-3552-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,220
    RFQ
    36-3552-10

    Datasheet

    36-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3554-10

    36-3554-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    3,977
    RFQ
    36-3554-10

    Datasheet

    36-3554-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6554-10

    36-6554-10

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,225
    RFQ
    36-6554-10

    Datasheet

    36-6554-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    614-93-428-31-012000

    614-93-428-31-012000

    SOCKET CARRIER LOWPRO .400 28POS

    Mill-Max Manufacturing Corp.

    3,191
    RFQ
    614-93-428-31-012000

    Datasheet

    614-93-428-31-012000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-428-31-012000

    614-43-428-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,282
    RFQ
    614-43-428-31-012000

    Datasheet

    614-43-428-31-012000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-210-41-003000

    126-41-210-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,838
    RFQ
    126-41-210-41-003000

    Datasheet

    126-41-210-41-003000 126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-210-41-003000

    126-91-210-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,344
    RFQ
    126-91-210-41-003000

    Datasheet

    126-91-210-41-003000 126 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-648-41-006000

    116-41-648-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,206
    RFQ
    116-41-648-41-006000

    Datasheet

    116-41-648-41-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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