Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    123-47-636-41-001000

    123-47-636-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    4,345
    RFQ
    123-47-636-41-001000

    Datasheet

    123-47-636-41-001000 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6501-31

    40-6501-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,157
    RFQ
    40-6501-31

    Datasheet

    40-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-81000-310C

    32-81000-310C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,746
    RFQ
    32-81000-310C

    Datasheet

    32-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-81000-610C

    32-81000-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,261
    RFQ
    32-81000-610C

    Datasheet

    32-81000-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-81250-610C

    32-81250-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,068
    RFQ
    32-81250-610C

    Datasheet

    32-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8240-610C

    32-8240-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,556
    RFQ
    32-8240-610C

    Datasheet

    32-8240-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8312-610C

    32-8312-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,577
    RFQ
    32-8312-610C

    Datasheet

    32-8312-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8350-610C

    32-8350-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,217
    RFQ
    32-8350-610C

    Datasheet

    32-8350-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8370-610C

    32-8370-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,353
    RFQ
    32-8370-610C

    Datasheet

    32-8370-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8375-610C

    32-8375-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,113
    RFQ
    32-8375-610C

    Datasheet

    32-8375-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8540-610C

    32-8540-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,503
    RFQ
    32-8540-610C

    Datasheet

    32-8540-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8600-610C

    32-8600-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,181
    RFQ
    32-8600-610C

    Datasheet

    32-8600-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8724-310C

    32-8724-310C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,391
    RFQ
    32-8724-310C

    Datasheet

    32-8724-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8724-610C

    32-8724-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,414
    RFQ
    32-8724-610C

    Datasheet

    32-8724-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-8850-610C

    32-8850-610C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,898
    RFQ
    32-8850-610C

    Datasheet

    32-8850-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-43-324-41-004000

    612-43-324-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,248
    RFQ
    612-43-324-41-004000

    Datasheet

    612-43-324-41-004000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-424-41-004000

    612-43-424-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,547
    RFQ
    612-43-424-41-004000

    Datasheet

    612-43-424-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-624-41-004000

    612-43-624-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,990
    RFQ
    612-43-624-41-004000

    Datasheet

    612-43-624-41-004000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-324-41-004000

    612-93-324-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,311
    RFQ
    612-93-324-41-004000

    Datasheet

    612-93-324-41-004000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-424-41-004000

    612-93-424-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,583
    RFQ
    612-93-424-41-004000

    Datasheet

    612-93-424-41-004000 612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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