Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-43-650-41-105000

    110-43-650-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,210
    RFQ
    110-43-650-41-105000

    Datasheet

    110-43-650-41-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-950-41-105000

    110-43-950-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,114
    RFQ
    110-43-950-41-105000

    Datasheet

    110-43-950-41-105000 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-328-41-801000

    110-43-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,936
    RFQ
    110-43-328-41-801000

    Datasheet

    110-43-328-41-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-41-801000

    110-93-328-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,339
    RFQ
    110-93-328-41-801000

    Datasheet

    110-93-328-41-801000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0512-G-T

    APH-0512-G-T

    APH-0512-G-T

    Samtec Inc.

    4,890
    RFQ

    -

    APH-0512-G-T * - Active - - - - - - - - - - - - - - -
    APH-1912-G-T

    APH-1912-G-T

    APH-1912-G-T

    Samtec Inc.

    3,432
    RFQ

    -

    APH-1912-G-T * - Active - - - - - - - - - - - - - - -
    APH-0212-G-T

    APH-0212-G-T

    APH-0212-G-T

    Samtec Inc.

    3,491
    RFQ

    -

    APH-0212-G-T * - Active - - - - - - - - - - - - - - -
    APH-1612-G-T

    APH-1612-G-T

    APH-1612-G-T

    Samtec Inc.

    2,158
    RFQ

    -

    APH-1612-G-T * - Active - - - - - - - - - - - - - - -
    APH-0912-G-T

    APH-0912-G-T

    APH-0912-G-T

    Samtec Inc.

    4,316
    RFQ

    -

    APH-0912-G-T * - Active - - - - - - - - - - - - - - -
    APH-0412-G-T

    APH-0412-G-T

    APH-0412-G-T

    Samtec Inc.

    4,109
    RFQ

    -

    APH-0412-G-T * - Active - - - - - - - - - - - - - - -
    116-41-650-41-003000

    116-41-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,596
    RFQ
    116-41-650-41-003000

    Datasheet

    116-41-650-41-003000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-650-41-003000

    116-91-650-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,650
    RFQ
    116-91-650-41-003000

    Datasheet

    116-91-650-41-003000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-652-41-001000

    110-11-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,466
    RFQ
    110-11-652-41-001000

    Datasheet

    110-11-652-41-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0318-T-31

    HLS-0318-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,378
    RFQ
    HLS-0318-T-31

    Datasheet

    HLS-0318-T-31 HLS Tube Active SIP 54 (3 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    104-11-636-41-770000

    104-11-636-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,493
    RFQ
    104-11-636-41-770000

    Datasheet

    104-11-636-41-770000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-318-41-001000

    123-13-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    4,332
    RFQ
    123-13-318-41-001000

    Datasheet

    123-13-318-41-001000 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3575-10

    32-3575-10

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,179
    RFQ
    32-3575-10

    Datasheet

    32-3575-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    123-11-322-41-001000

    123-11-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,901
    RFQ
    123-11-322-41-001000

    Datasheet

    123-11-322-41-001000 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-422-41-001000

    123-11-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,965
    RFQ
    123-11-422-41-001000

    Datasheet

    123-11-422-41-001000 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-0508-21

    27-0508-21

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    2,126
    RFQ
    27-0508-21

    Datasheet

    27-0508-21 508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    Total 19086 Record«Prev1... 679680681682683684685686...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER