Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    36-6556-20

    36-6556-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,355
    RFQ
    36-6556-20

    Datasheet

    36-6556-20 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    30-6621-30

    30-6621-30

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    3,058
    RFQ
    30-6621-30

    Datasheet

    30-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-7950-10

    40-7950-10

    CONN SOCKET SIP 40POS TIN

    Aries Electronics

    3,226
    RFQ
    40-7950-10

    Datasheet

    40-7950-10 700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-41-636-31-002000

    614-41-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,955
    RFQ
    614-41-636-31-002000

    Datasheet

    614-41-636-31-002000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-636-31-002000

    614-91-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,097
    RFQ
    614-91-636-31-002000

    Datasheet

    614-91-636-31-002000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-650-41-007000

    116-47-650-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,623
    RFQ
    116-47-650-41-007000

    Datasheet

    116-47-650-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-636-31-007000

    614-41-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,821
    RFQ
    614-41-636-31-007000

    Datasheet

    614-41-636-31-007000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-636-31-007000

    614-91-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,239
    RFQ
    614-91-636-31-007000

    Datasheet

    614-91-636-31-007000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-318-G-Q

    APA-318-G-Q

    ADAPTER PLUG

    Samtec Inc.

    2,732
    RFQ
    APA-318-G-Q

    Datasheet

    APA-318-G-Q APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-3575-10

    40-3575-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,939
    RFQ
    40-3575-10

    Datasheet

    40-3575-10 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6571-10

    40-6571-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,501
    RFQ
    40-6571-10

    Datasheet

    40-6571-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6573-10

    40-6573-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    4,688
    RFQ
    40-6573-10

    Datasheet

    40-6573-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6575-10

    40-6575-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    4,938
    RFQ
    40-6575-10

    Datasheet

    40-6575-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0414-S-2

    HLS-0414-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,628
    RFQ
    HLS-0414-S-2

    Datasheet

    HLS-0414-S-2 HLS Bulk Active SIP 56 (4 x 14) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    32-6575-10

    32-6575-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,324
    RFQ
    32-6575-10

    Datasheet

    32-6575-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6574-10

    32-6574-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,732
    RFQ
    32-6574-10

    Datasheet

    32-6574-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    126-41-636-41-001000

    126-41-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,694
    RFQ
    126-41-636-41-001000

    Datasheet

    126-41-636-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-636-41-001000

    126-91-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,271
    RFQ
    126-91-636-41-001000

    Datasheet

    126-91-636-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-364-17-091111

    517-87-364-17-091111

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    3,275
    RFQ
    517-87-364-17-091111

    Datasheet

    517-87-364-17-091111 517 Bulk Active PGA 364 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-8350-610C

    28-8350-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,559
    RFQ
    28-8350-610C

    Datasheet

    28-8350-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 684685686687688689690691...955Next»
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