Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    122-13-624-41-001000

    122-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    3,529
    RFQ
    122-13-624-41-001000

    Datasheet

    122-13-624-41-001000 122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0928-T-R

    APH-0928-T-R

    APH-0928-T-R

    Samtec Inc.

    4,490
    RFQ

    -

    APH-0928-T-R * - Active - - - - - - - - - - - - - - -
    APH-0728-T-R

    APH-0728-T-R

    APH-0728-T-R

    Samtec Inc.

    3,866
    RFQ

    -

    APH-0728-T-R * - Active - - - - - - - - - - - - - - -
    APH-1228-T-R

    APH-1228-T-R

    APH-1228-T-R

    Samtec Inc.

    3,858
    RFQ

    -

    APH-1228-T-R * - Active - - - - - - - - - - - - - - -
    APH-0228-T-R

    APH-0228-T-R

    APH-0228-T-R

    Samtec Inc.

    2,694
    RFQ

    -

    APH-0228-T-R * - Active - - - - - - - - - - - - - - -
    APH-1628-T-R

    APH-1628-T-R

    APH-1628-T-R

    Samtec Inc.

    2,894
    RFQ

    -

    APH-1628-T-R * - Active - - - - - - - - - - - - - - -
    44-6556-30

    44-6556-30

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    4,387
    RFQ
    44-6556-30

    Datasheet

    44-6556-30 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-20

    44-6556-20

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    2,257
    RFQ
    44-6556-20

    Datasheet

    44-6556-20 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    24-3551-11

    24-3551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,123
    RFQ
    24-3551-11

    Datasheet

    24-3551-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3552-11

    24-3552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,839
    RFQ
    24-3552-11

    Datasheet

    24-3552-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3553-11

    24-3553-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    3,830
    RFQ
    24-3553-11

    Datasheet

    24-3553-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6551-11

    24-6551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,634
    RFQ
    24-6551-11

    Datasheet

    24-6551-11 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6552-11

    24-6552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,677
    RFQ
    24-6552-11

    Datasheet

    24-6552-11 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3554-11

    24-3554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    3,483
    RFQ
    24-3554-11

    Datasheet

    24-3554-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    210790-4

    210790-4

    CONN SOCKET PGA 128POS GOLD

    TE Connectivity AMP Connectors

    4,387
    RFQ
    210790-4

    Datasheet

    210790-4 STA Bulk Obsolete PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 118.1µin (3.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
    24-3503-31

    24-3503-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,484
    RFQ
    24-3503-31

    Datasheet

    24-3503-31 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6572-10

    40-6572-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,261
    RFQ
    40-6572-10

    Datasheet

    40-6572-10 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APA-648-T-C

    APA-648-T-C

    ADAPTER PLUG

    Samtec Inc.

    4,848
    RFQ
    APA-648-T-C

    Datasheet

    APA-648-T-C APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-432-41-001000

    126-93-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,460
    RFQ
    126-93-432-41-001000

    Datasheet

    126-93-432-41-001000 126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-632-41-001000

    126-93-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,755
    RFQ
    126-93-632-41-001000

    Datasheet

    126-93-632-41-001000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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