Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-43-636-31-002000

    614-43-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,954
    RFQ
    614-43-636-31-002000

    Datasheet

    614-43-636-31-002000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-636-31-002000

    614-93-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,414
    RFQ
    614-93-636-31-002000

    Datasheet

    614-93-636-31-002000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-516-11S

    40-516-11S

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,205
    RFQ
    40-516-11S

    Datasheet

    40-516-11S 516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-93-636-31-007000

    614-93-636-31-007000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    3,785
    RFQ
    614-93-636-31-007000

    Datasheet

    614-93-636-31-007000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-636-31-007000

    614-43-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,309
    RFQ
    614-43-636-31-007000

    Datasheet

    614-43-636-31-007000 614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-328-61-001000

    110-41-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,192
    RFQ

    -

    110-41-328-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-628-61-001000

    110-41-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,028
    RFQ

    -

    110-41-628-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-628-61-001000

    110-43-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,566
    RFQ

    -

    110-43-628-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-328-61-001000

    110-44-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,748
    RFQ

    -

    110-44-328-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-628-61-001000

    110-44-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,040
    RFQ

    -

    110-44-628-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-328-61-001000

    110-93-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,958
    RFQ

    -

    110-93-328-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-628-61-001000

    110-93-628-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,671
    RFQ

    -

    110-93-628-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-640-11-480000

    605-93-640-11-480000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    2,478
    RFQ
    605-93-640-11-480000

    Datasheet

    605-93-640-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-640-11-480000

    605-43-640-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,376
    RFQ
    605-43-640-11-480000

    Datasheet

    605-43-640-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-632-61-001000

    110-41-632-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,445
    RFQ

    -

    110-41-632-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-632-61-001000

    110-44-632-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,099
    RFQ

    -

    110-44-632-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-3508-21

    18-3508-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,160
    RFQ
    18-3508-21

    Datasheet

    18-3508-21 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-3508-31

    18-3508-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,501
    RFQ
    18-3508-31

    Datasheet

    18-3508-31 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    299-93-612-10-002000

    299-93-612-10-002000

    CONN IC DIP SOCKET 12POS GOLD

    Mill-Max Manufacturing Corp.

    2,026
    RFQ
    299-93-612-10-002000

    Datasheet

    299-93-612-10-002000 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-642-41-007000

    116-93-642-41-007000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    3,626
    RFQ
    116-93-642-41-007000

    Datasheet

    116-93-642-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 703704705706707708709710...955Next»
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