Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1918-G-T

    APH-1918-G-T

    APH-1918-G-T

    Samtec Inc.

    3,071
    RFQ

    -

    APH-1918-G-T * - Active - - - - - - - - - - - - - - -
    APH-0618-G-T

    APH-0618-G-T

    APH-0618-G-T

    Samtec Inc.

    3,548
    RFQ

    -

    APH-0618-G-T * - Active - - - - - - - - - - - - - - -
    APH-1118-G-T

    APH-1118-G-T

    APH-1118-G-T

    Samtec Inc.

    3,526
    RFQ

    -

    APH-1118-G-T * - Active - - - - - - - - - - - - - - -
    APH-0218-G-T

    APH-0218-G-T

    APH-0218-G-T

    Samtec Inc.

    4,988
    RFQ

    -

    APH-0218-G-T * - Active - - - - - - - - - - - - - - -
    APH-1318-G-T

    APH-1318-G-T

    APH-1318-G-T

    Samtec Inc.

    3,365
    RFQ

    -

    APH-1318-G-T * - Active - - - - - - - - - - - - - - -
    APH-0718-G-T

    APH-0718-G-T

    APH-0718-G-T

    Samtec Inc.

    2,859
    RFQ

    -

    APH-0718-G-T * - Active - - - - - - - - - - - - - - -
    APH-1618-G-T

    APH-1618-G-T

    APH-1618-G-T

    Samtec Inc.

    2,201
    RFQ

    -

    APH-1618-G-T * - Active - - - - - - - - - - - - - - -
    APH-0818-G-T

    APH-0818-G-T

    APH-0818-G-T

    Samtec Inc.

    3,423
    RFQ

    -

    APH-0818-G-T * - Active - - - - - - - - - - - - - - -
    APH-1218-G-T

    APH-1218-G-T

    APH-1218-G-T

    Samtec Inc.

    2,516
    RFQ

    -

    APH-1218-G-T * - Active - - - - - - - - - - - - - - -
    APH-0318-G-T

    APH-0318-G-T

    APH-0318-G-T

    Samtec Inc.

    3,310
    RFQ

    -

    APH-0318-G-T * - Active - - - - - - - - - - - - - - -
    133-PGM13046-10

    133-PGM13046-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,003
    RFQ
    133-PGM13046-10

    Datasheet

    133-PGM13046-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM14013-10

    133-PGM14013-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,084
    RFQ
    133-PGM14013-10

    Datasheet

    133-PGM14013-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    160-PGM15056-10

    160-PGM15056-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,409
    RFQ
    160-PGM15056-10

    Datasheet

    160-PGM15056-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-121-13-061112

    614-83-121-13-061112

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    3,792
    RFQ
    614-83-121-13-061112

    Datasheet

    614-83-121-13-061112 614 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-642-41-001000

    116-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,734
    RFQ
    116-41-642-41-001000

    Datasheet

    116-41-642-41-001000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-642-41-001000

    116-91-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,295
    RFQ
    116-91-642-41-001000

    Datasheet

    116-91-642-41-001000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    316-93-132-41-001000

    316-93-132-41-001000

    SOCKET ELEVATED SIP 32POS

    Mill-Max Manufacturing Corp.

    4,271
    RFQ
    316-93-132-41-001000

    Datasheet

    316-93-132-41-001000 316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-163-31-018000

    714-43-163-31-018000

    CONN SOCKET SIP 63POS GOLD

    Mill-Max Manufacturing Corp.

    3,471
    RFQ
    714-43-163-31-018000

    Datasheet

    714-43-163-31-018000 714 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6556-30

    48-6556-30

    UNIVERSAL TEST SOCKET 48POS

    Aries Electronics

    2,543
    RFQ

    -

    48-6556-30 6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    48-3551-10

    48-3551-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    3,299
    RFQ
    48-3551-10

    Datasheet

    48-3551-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 719720721722723724725726...955Next»
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