Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-93-424-61-003000

    115-93-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,674
    RFQ

    -

    115-93-424-61-003000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-636-41-003000

    126-93-636-41-003000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    3,349
    RFQ
    126-93-636-41-003000

    Datasheet

    126-93-636-41-003000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-636-41-003000

    126-43-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,721
    RFQ
    126-43-636-41-003000

    Datasheet

    126-43-636-41-003000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-007000

    116-93-950-41-007000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    3,561
    RFQ
    116-93-950-41-007000

    Datasheet

    116-93-950-41-007000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-007000

    116-43-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,639
    RFQ
    116-43-950-41-007000

    Datasheet

    116-43-950-41-007000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-652-41-003000

    612-41-652-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,514
    RFQ
    612-41-652-41-003000

    Datasheet

    612-41-652-41-003000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-652-41-003000

    612-91-652-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,652
    RFQ
    612-91-652-41-003000

    Datasheet

    612-91-652-41-003000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-648-41-780000

    104-13-648-41-780000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    2,719
    RFQ
    104-13-648-41-780000

    Datasheet

    104-13-648-41-780000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    33-0511-11

    33-0511-11

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    3,638
    RFQ
    33-0511-11

    Datasheet

    33-0511-11 511 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    104-13-652-41-770000

    104-13-652-41-770000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    2,034
    RFQ
    104-13-652-41-770000

    Datasheet

    104-13-652-41-770000 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    28-3503-21

    28-3503-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,256
    RFQ
    28-3503-21

    Datasheet

    28-3503-21 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3503-31

    28-3503-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,176
    RFQ
    28-3503-31

    Datasheet

    28-3503-31 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-526-11

    40-526-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    2,113
    RFQ
    40-526-11

    Datasheet

    40-526-11 Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-44-322-61-001000

    110-44-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,035
    RFQ

    -

    110-44-322-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-422-61-001000

    110-44-422-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,833
    RFQ

    -

    110-44-422-61-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-306-61-003000

    115-93-306-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,065
    RFQ

    -

    115-93-306-61-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-192M16-001148

    514-87-192M16-001148

    CONN SOCKET BGA 192POS GOLD

    Preci-Dip

    3,825
    RFQ
    514-87-192M16-001148

    Datasheet

    514-87-192M16-001148 514 Bulk Active BGA 192 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-648-WGG-2

    ICA-648-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,928
    RFQ
    ICA-648-WGG-2

    Datasheet

    ICA-648-WGG-2 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    117-43-620-61-005000

    117-43-620-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,170
    RFQ

    -

    117-43-620-61-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    85-PGM11008-11

    85-PGM11008-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,060
    RFQ
    85-PGM11008-11

    Datasheet

    85-PGM11008-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 763764765766767768769770...955Next»
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