Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    SA326040

    SA326040

    CONN IC DIP SOCKET 32POS GOLD

    On Shore Technology Inc.

    2,302
    RFQ
    SA326040

    Datasheet

    SA326040 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    PLCC-68-AT

    PLCC-68-AT

    PLCC 68P THROUGH HOLE

    Adam Tech

    4,595
    RFQ
    PLCC-68-AT

    Datasheet

    PLCC-68-AT PLCC Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    SA406040

    SA406040

    CONN IC DIP SOCKET 40POS GOLD

    On Shore Technology Inc.

    2,073
    RFQ
    SA406040

    Datasheet

    SA406040 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    28-6518-10

    28-6518-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,575
    RFQ
    28-6518-10

    Datasheet

    28-6518-10 518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    917-43-108-41-005000

    917-43-108-41-005000

    CONN TRANSIST TO-5 8POS GOLD

    Mill-Max Manufacturing Corp.

    3,657
    RFQ
    917-43-108-41-005000

    Datasheet

    917-43-108-41-005000 917 Tube Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    382

    382

    CONN IC DIP SOCKET 28POS

    Adafruit Industries LLC

    22
    RFQ
    382

    Datasheet

    382 - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - - - - - - - - - - -
    28-3518-10

    28-3518-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4
    RFQ
    28-3518-10

    Datasheet

    28-3518-10 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    MIKROE-425

    MIKROE-425

    40 PIN ZIF SOCKET

    MikroElektronika

    8
    RFQ
    MIKROE-425

    Datasheet

    MIKROE-425 - Box Active DIP, ZIF (ZIP) 40 (2 x 20) - - - - Through Hole Closed Frame Solder - - - - - -
    4732

    4732

    COVER PWR TRANS .210"ID TO-3

    Keystone Electronics

    3
    RFQ
    4732

    Datasheet

    4732 - Bulk Active - - - - - - - - - - - - - - -
    224-1286-00-0602J

    224-1286-00-0602J

    CONN IC DIP SOCKET ZIF 24POS GLD

    3M

    2,561
    RFQ
    224-1286-00-0602J

    Datasheet

    224-1286-00-0602J Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    224-5248-00-0602J

    224-5248-00-0602J

    CONN IC DIP SOCKET ZIF 24POS GLD

    3M

    2,833
    RFQ
    224-5248-00-0602J

    Datasheet

    224-5248-00-0602J Textool™ Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    214-7390-55-1902

    214-7390-55-1902

    CONN SOCKET SOIC 14POS GOLD

    3M

    1
    RFQ
    214-7390-55-1902

    Datasheet

    214-7390-55-1902 Textool™ Bulk Active SOIC 14 (2 x 7) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    228-1371-00-0602J

    228-1371-00-0602J

    CONN IC DIP SOCKET ZIF 28POS GLD

    3M

    3
    RFQ
    228-1371-00-0602J

    Datasheet

    228-1371-00-0602J Textool™ Tray Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    216-5205-01

    216-5205-01

    CONN SOCKET QFN 16POS GOLD

    3M

    4,482
    RFQ
    216-5205-01

    Datasheet

    216-5205-01 Textool™ Bulk Active QFN 16 (3x3) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    228-5204-01

    228-5204-01

    CONN SOCKET QFN 28POS GOLD

    3M

    2,912
    RFQ
    228-5204-01

    Datasheet

    228-5204-01 Textool™ Bulk Active QFN 28 (4 x 7) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    115-93-308-41-003000

    115-93-308-41-003000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    2,115
    RFQ
    115-93-308-41-003000

    Datasheet

    115-93-308-41-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    940-44-020-17-400000

    940-44-020-17-400000

    CONN SOCKET PLCC 20POS TIN

    Mill-Max Manufacturing Corp.

    2,836
    RFQ
    940-44-020-17-400000

    Datasheet

    940-44-020-17-400000 940 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    214-99-316-01-670800

    214-99-316-01-670800

    CONN IC DIP SOCKET 16POS TINLEAD

    Mill-Max Manufacturing Corp.

    15
    RFQ
    214-99-316-01-670800

    Datasheet

    214-99-316-01-670800 214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    XR2A-1411-N

    XR2A-1411-N

    CONN IC DIP SOCKET 14POS GOLD

    Omron Electronics Inc-EMC Div

    2,837
    RFQ
    XR2A-1411-N

    Datasheet

    XR2A-1411-N XR2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    AR 16-HZW/TN

    AR 16-HZW/TN

    CONN IC DIP SOCKET 16POS GOLD

    Assmann WSW Components

    3,675
    RFQ
    AR 16-HZW/TN

    Datasheet

    AR 16-HZW/TN - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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