Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-310-61-007000

    116-43-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,723
    RFQ

    -

    116-43-310-61-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-310-61-007000

    116-93-310-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,032
    RFQ

    -

    116-93-310-61-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0501-21

    37-0501-21

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,990
    RFQ
    37-0501-21

    Datasheet

    37-0501-21 501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    37-0501-31

    37-0501-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    2,854
    RFQ
    37-0501-31

    Datasheet

    37-0501-31 501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-81000-610C

    40-81000-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,300
    RFQ
    40-81000-610C

    Datasheet

    40-81000-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8300-310C

    40-8300-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,938
    RFQ
    40-8300-310C

    Datasheet

    40-8300-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8350-610C

    40-8350-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,790
    RFQ
    40-8350-610C

    Datasheet

    40-8350-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8600-610C

    40-8600-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,137
    RFQ
    40-8600-610C

    Datasheet

    40-8600-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8620-610C

    40-8620-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,313
    RFQ
    40-8620-610C

    Datasheet

    40-8620-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8785-310C

    40-8785-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,154
    RFQ
    40-8785-310C

    Datasheet

    40-8785-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8785-610C

    40-8785-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,830
    RFQ
    40-8785-610C

    Datasheet

    40-8785-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8800-610C

    40-8800-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,687
    RFQ
    40-8800-610C

    Datasheet

    40-8800-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8810-610C

    40-8810-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,950
    RFQ
    40-8810-610C

    Datasheet

    40-8810-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-11-636-41-001000

    123-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,688
    RFQ
    123-11-636-41-001000

    Datasheet

    123-11-636-41-001000 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-304-14-051111

    517-83-304-14-051111

    CONN SOCKET PGA 304POS GOLD

    Preci-Dip

    4,588
    RFQ
    517-83-304-14-051111

    Datasheet

    517-83-304-14-051111 517 Bulk Active PGA 304 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-93-164-31-007000

    714-93-164-31-007000

    CONN SOCKET SIP 64POS GOLD

    Mill-Max Manufacturing Corp.

    3,877
    RFQ
    714-93-164-31-007000

    Datasheet

    714-93-164-31-007000 714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-G-R

    APO-320-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,621
    RFQ
    APO-320-G-R

    Datasheet

    APO-320-G-R APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1416-G-H

    APH-1416-G-H

    APH-1416-G-H

    Samtec Inc.

    4,473
    RFQ

    -

    APH-1416-G-H * - Active - - - - - - - - - - - - - - -
    APH-1916-G-H

    APH-1916-G-H

    APH-1916-G-H

    Samtec Inc.

    3,504
    RFQ

    -

    APH-1916-G-H * - Active - - - - - - - - - - - - - - -
    APH-0416-G-H

    APH-0416-G-H

    APH-0416-G-H

    Samtec Inc.

    2,100
    RFQ

    -

    APH-0416-G-H * - Active - - - - - - - - - - - - - - -
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