Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0340-T-H

    APH-0340-T-H

    APH-0340-T-H

    Samtec Inc.

    4,785
    RFQ

    -

    APH-0340-T-H * - Active - - - - - - - - - - - - - - -
    116-93-964-41-003000

    116-93-964-41-003000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    3,023
    RFQ
    116-93-964-41-003000

    Datasheet

    116-93-964-41-003000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-964-41-003000

    116-43-964-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,760
    RFQ
    116-43-964-41-003000

    Datasheet

    116-43-964-41-003000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-324-61-007000

    116-43-324-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,731
    RFQ

    -

    116-43-324-61-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-624-61-007000

    116-43-624-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,374
    RFQ

    -

    116-43-624-61-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-624-61-007000

    116-93-624-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,676
    RFQ

    -

    116-93-624-61-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-640-61-003000

    115-93-640-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,260
    RFQ

    -

    115-93-640-61-003000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-83-325-18-111111

    517-83-325-18-111111

    CONN SOCKET PGA 325POS GOLD

    Preci-Dip

    4,270
    RFQ
    517-83-325-18-111111

    Datasheet

    517-83-325-18-111111 517 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-93-950-41-001000

    612-93-950-41-001000

    SOCKET CARRIER SLDRTL .900 50POS

    Mill-Max Manufacturing Corp.

    3,573
    RFQ
    612-93-950-41-001000

    Datasheet

    612-93-950-41-001000 612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-950-41-001000

    612-43-950-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,053
    RFQ
    612-43-950-41-001000

    Datasheet

    612-43-950-41-001000 612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-83-175-16-071117

    514-83-175-16-071117

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    2,547
    RFQ
    514-83-175-16-071117

    Datasheet

    514-83-175-16-071117 514 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    126-41-952-41-002000

    126-41-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,575
    RFQ
    126-41-952-41-002000

    Datasheet

    126-41-952-41-002000 126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-952-41-002000

    126-91-952-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,237
    RFQ
    126-91-952-41-002000

    Datasheet

    126-91-952-41-002000 126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    60-9503-20

    60-9503-20

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    2,460
    RFQ
    60-9503-20

    Datasheet

    60-9503-20 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    60-9503-30

    60-9503-30

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    3,584
    RFQ
    60-9503-30

    Datasheet

    60-9503-30 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0820-TT-2

    HLS-0820-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,544
    RFQ
    HLS-0820-TT-2

    Datasheet

    HLS-0820-TT-2 HLS Bulk Active SIP 160 (8 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-41-964-31-018000

    614-41-964-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,966
    RFQ
    614-41-964-31-018000

    Datasheet

    614-41-964-31-018000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-964-31-018000

    614-91-964-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,198
    RFQ
    614-91-964-31-018000

    Datasheet

    614-91-964-31-018000 614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-C182-21

    28-C182-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,092
    RFQ
    28-C182-21

    Datasheet

    28-C182-21 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-C182-31

    28-C182-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,865
    RFQ
    28-C182-31

    Datasheet

    28-C182-31 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 781782783784785786787788...955Next»
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