Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    126-43-652-41-002000

    126-43-652-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,594
    RFQ
    126-43-652-41-002000

    Datasheet

    126-43-652-41-002000 126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-964-11-480000

    605-93-964-11-480000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    2,977
    RFQ
    605-93-964-11-480000

    Datasheet

    605-93-964-11-480000 605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-964-11-480000

    605-43-964-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,103
    RFQ
    605-43-964-11-480000

    Datasheet

    605-43-964-11-480000 605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-952-41-001000

    116-47-952-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,581
    RFQ
    116-47-952-41-001000

    Datasheet

    116-47-952-41-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-650-61-001000

    110-99-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,595
    RFQ

    -

    110-99-650-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-952-41-001000

    126-93-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,237
    RFQ
    126-93-952-41-001000

    Datasheet

    126-93-952-41-001000 126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-952-41-001000

    126-43-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,398
    RFQ
    126-43-952-41-001000

    Datasheet

    126-43-952-41-001000 126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-636-61-001000

    110-41-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,279
    RFQ

    -

    110-41-636-61-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-650-41-001000

    122-11-650-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,201
    RFQ
    122-11-650-41-001000

    Datasheet

    122-11-650-41-001000 122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-3570-11

    28-3570-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    3,169
    RFQ
    28-3570-11

    Datasheet

    28-3570-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3571-11

    28-3571-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,238
    RFQ
    28-3571-11

    Datasheet

    28-3571-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3573-11

    28-3573-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    3,688
    RFQ
    28-3573-11

    Datasheet

    28-3573-11 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6570-11

    28-6570-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    3,725
    RFQ
    28-6570-11

    Datasheet

    28-6570-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6571-11

    28-6571-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    2,561
    RFQ
    28-6571-11

    Datasheet

    28-6571-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6573-11

    28-6573-11

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,629
    RFQ
    28-6573-11

    Datasheet

    28-6573-11 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-133-14-071101

    550-10-133-14-071101

    PGA SOLDER TAIL

    Preci-Dip

    3,460
    RFQ
    550-10-133-14-071101

    Datasheet

    550-10-133-14-071101 550 Bulk Active PGA 133 (14 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-178-18-111136

    546-83-178-18-111136

    CONN SOCKET PGA 178POS GOLD

    Preci-Dip

    4,414
    RFQ
    546-83-178-18-111136

    Datasheet

    546-83-178-18-111136 546 Bulk Active PGA 178 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-43-430-61-005000

    117-43-430-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,693
    RFQ

    -

    117-43-430-61-005000 117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-952-41-003000

    612-43-952-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,220
    RFQ
    612-43-952-41-003000

    Datasheet

    612-43-952-41-003000 612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-952-41-003000

    612-93-952-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,020
    RFQ
    612-93-952-41-003000

    Datasheet

    612-93-952-41-003000 612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 791792793794795796797798...955Next»
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