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    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-43-642-61-105000

    110-43-642-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,542
    RFQ

    -

    110-43-642-61-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-642-61-105000

    110-93-642-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,202
    RFQ

    -

    110-93-642-61-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-81000-310C

    40-81000-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,386
    RFQ
    40-81000-310C

    Datasheet

    40-81000-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-81150-610C

    40-81150-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,324
    RFQ
    40-81150-610C

    Datasheet

    40-81150-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-81250-310C

    40-81250-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,462
    RFQ
    40-81250-310C

    Datasheet

    40-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-81250-610C

    40-81250-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,338
    RFQ
    40-81250-610C

    Datasheet

    40-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8260-610C

    40-8260-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,303
    RFQ
    40-8260-610C

    Datasheet

    40-8260-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8320-610C

    40-8320-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,501
    RFQ
    40-8320-610C

    Datasheet

    40-8320-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8370-610C

    40-8370-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,598
    RFQ
    40-8370-610C

    Datasheet

    40-8370-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8435-310C

    40-8435-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,483
    RFQ
    40-8435-310C

    Datasheet

    40-8435-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8460-610C

    40-8460-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,624
    RFQ
    40-8460-610C

    Datasheet

    40-8460-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8500-610C

    40-8500-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,672
    RFQ
    40-8500-610C

    Datasheet

    40-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8530-610C

    40-8530-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,487
    RFQ
    40-8530-610C

    Datasheet

    40-8530-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8625-610C

    40-8625-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,419
    RFQ
    40-8625-610C

    Datasheet

    40-8625-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8650-610C

    40-8650-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,634
    RFQ
    40-8650-610C

    Datasheet

    40-8650-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8700-310C

    40-8700-310C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,914
    RFQ
    40-8700-310C

    Datasheet

    40-8700-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8700-610C

    40-8700-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,670
    RFQ
    40-8700-610C

    Datasheet

    40-8700-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-8770-610C

    40-8770-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,605
    RFQ
    40-8770-610C

    Datasheet

    40-8770-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    121-13-652-41-001000

    121-13-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    3,015
    RFQ
    121-13-652-41-001000

    Datasheet

    121-13-652-41-001000 121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-952-41-001000

    116-41-952-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,259
    RFQ
    116-41-952-41-001000

    Datasheet

    116-41-952-41-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 799800801802803804805806...955Next»
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