Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-C300-21

    32-C300-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,815
    RFQ
    32-C300-21

    Datasheet

    32-C300-21 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-C300-31

    32-C300-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,705
    RFQ
    32-C300-31

    Datasheet

    32-C300-31 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    612-13-650-41-001000

    612-13-650-41-001000

    SOCKET CARRIER SLDRTL .600 50POS

    Mill-Max Manufacturing Corp.

    3,078
    RFQ
    612-13-650-41-001000

    Datasheet

    612-13-650-41-001000 612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-3551-11

    42-3551-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,276
    RFQ
    42-3551-11

    Datasheet

    42-3551-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3552-11

    42-3552-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    3,146
    RFQ
    42-3552-11

    Datasheet

    42-3552-11 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6551-11

    42-6551-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    3,900
    RFQ
    42-6551-11

    Datasheet

    42-6551-11 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6552-11

    42-6552-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    2,064
    RFQ
    42-6552-11

    Datasheet

    42-6552-11 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    510-41-069-11-061001

    510-41-069-11-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,617
    RFQ
    510-41-069-11-061001

    Datasheet

    510-41-069-11-061001 510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-128-13-041001

    510-93-128-13-041001

    SOCKET SOLDERTAIL 128-PGA

    Mill-Max Manufacturing Corp.

    4,895
    RFQ

    -

    510-93-128-13-041001 510 Tube Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6508-211

    32-6508-211

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,626
    RFQ
    32-6508-211

    Datasheet

    32-6508-211 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6508-311

    32-6508-311

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,441
    RFQ
    32-6508-311

    Datasheet

    32-6508-311 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-44-964-61-001000

    110-44-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,328
    RFQ

    -

    110-44-964-61-001000 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-950-61-001000

    110-41-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,317
    RFQ

    -

    110-41-950-61-001000 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-001000

    116-93-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,601
    RFQ
    116-93-950-41-001000

    Datasheet

    116-93-950-41-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-001000

    116-43-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,051
    RFQ
    116-43-950-41-001000

    Datasheet

    116-43-950-41-001000 116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-652-41-001000

    122-13-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,455
    RFQ
    122-13-652-41-001000

    Datasheet

    122-13-652-41-001000 122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-648-61-006000

    116-43-648-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,124
    RFQ

    -

    116-43-648-61-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0510-G-11

    HLS-0510-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,252
    RFQ
    HLS-0510-G-11

    Datasheet

    HLS-0510-G-11 HLS Bulk Active SIP 50 (5 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-43-640-61-007000

    116-43-640-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,891
    RFQ

    -

    116-43-640-61-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-8750-610C

    40-8750-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,698
    RFQ
    40-8750-610C

    Datasheet

    40-8750-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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