Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0938-G-H

    APH-0938-G-H

    APH-0938-G-H

    Samtec Inc.

    2,103
    RFQ

    -

    APH-0938-G-H * - Active - - - - - - - - - - - - - - -
    APH-1738-G-H

    APH-1738-G-H

    APH-1738-G-H

    Samtec Inc.

    3,656
    RFQ

    -

    APH-1738-G-H * - Active - - - - - - - - - - - - - - -
    APH-0438-G-H

    APH-0438-G-H

    APH-0438-G-H

    Samtec Inc.

    3,971
    RFQ

    -

    APH-0438-G-H * - Active - - - - - - - - - - - - - - -
    APH-1138-G-H

    APH-1138-G-H

    APH-1138-G-H

    Samtec Inc.

    3,889
    RFQ

    -

    APH-1138-G-H * - Active - - - - - - - - - - - - - - -
    32-6556-41

    32-6556-41

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,531
    RFQ
    32-6556-41

    Datasheet

    32-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    124-PGM13008-41

    124-PGM13008-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,988
    RFQ
    124-PGM13008-41

    Datasheet

    124-PGM13008-41 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6553-16

    24-6553-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,350
    RFQ
    24-6553-16

    Datasheet

    24-6553-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6556-40

    36-6556-40

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,782
    RFQ
    36-6556-40

    Datasheet

    36-6556-40 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1440-G-T

    APH-1440-G-T

    APH-1440-G-T

    Samtec Inc.

    4,860
    RFQ

    -

    APH-1440-G-T * - Active - - - - - - - - - - - - - - -
    APH-1940-G-T

    APH-1940-G-T

    APH-1940-G-T

    Samtec Inc.

    4,958
    RFQ

    -

    APH-1940-G-T * - Active - - - - - - - - - - - - - - -
    APH-1540-G-T

    APH-1540-G-T

    APH-1540-G-T

    Samtec Inc.

    2,212
    RFQ

    -

    APH-1540-G-T * - Active - - - - - - - - - - - - - - -
    APH-1040-G-T

    APH-1040-G-T

    APH-1040-G-T

    Samtec Inc.

    3,180
    RFQ

    -

    APH-1040-G-T * - Active - - - - - - - - - - - - - - -
    APH-0240-G-T

    APH-0240-G-T

    APH-0240-G-T

    Samtec Inc.

    4,266
    RFQ

    -

    APH-0240-G-T * - Active - - - - - - - - - - - - - - -
    APH-0340-G-T

    APH-0340-G-T

    APH-0340-G-T

    Samtec Inc.

    3,791
    RFQ

    -

    APH-0340-G-T * - Active - - - - - - - - - - - - - - -
    APH-1240-G-T

    APH-1240-G-T

    APH-1240-G-T

    Samtec Inc.

    4,157
    RFQ

    -

    APH-1240-G-T * - Active - - - - - - - - - - - - - - -
    APH-1640-G-T

    APH-1640-G-T

    APH-1640-G-T

    Samtec Inc.

    4,414
    RFQ

    -

    APH-1640-G-T * - Active - - - - - - - - - - - - - - -
    550-10-432M31-001166

    550-10-432M31-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,596
    RFQ
    550-10-432M31-001166

    Datasheet

    550-10-432M31-001166 550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    192-PGM17025-11

    192-PGM17025-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,742
    RFQ
    192-PGM17025-11

    Datasheet

    192-PGM17025-11 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    546-87-463-19-101147

    546-87-463-19-101147

    CONN SOCKET PGA 463POS GOLD

    Preci-Dip

    4,922
    RFQ
    546-87-463-19-101147

    Datasheet

    546-87-463-19-101147 546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-299-20-001112

    614-83-299-20-001112

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    2,385
    RFQ
    614-83-299-20-001112

    Datasheet

    614-83-299-20-001112 614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 874875876877878879880881...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER