Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    1825093-5

    1825093-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,578
    RFQ
    1825093-5

    Datasheet

    1825093-5 Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825093-6

    1825093-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,633
    RFQ
    1825093-6

    Datasheet

    1825093-6 Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825108-2

    1825108-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,432
    RFQ

    -

    1825108-2 Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825109-2

    1825109-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,259
    RFQ

    -

    1825109-2 Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825108-3

    1825108-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,000
    RFQ

    -

    1825108-3 Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825093-2

    1-1825093-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,223
    RFQ
    1-1825093-2

    Datasheet

    1-1825093-2 Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825109-2

    1-1825109-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,115
    RFQ
    1-1825109-2

    Datasheet

    1-1825109-2 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825276-2

    1-1825276-2

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,904
    RFQ
    1-1825276-2

    Datasheet

    1-1825276-2 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825109-3

    1-1825109-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    4,179
    RFQ
    1-1825109-3

    Datasheet

    1-1825109-3 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1825373-2

    1825373-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,182
    RFQ
    1825373-2

    Datasheet

    1825373-2 Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825093-4

    1-1825093-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    3,375
    RFQ
    1-1825093-4

    Datasheet

    1-1825093-4 Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825108-2

    1-1825108-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,330
    RFQ

    -

    1-1825108-2 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-390261-2

    1-390261-2

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    2,520
    RFQ
    1-390261-2

    Datasheet

    1-390261-2 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390261-3

    1-390261-3

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    3,610
    RFQ
    1-390261-3

    Datasheet

    1-390261-3 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390261-4

    1-390261-4

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    2,491
    RFQ
    1-390261-4

    Datasheet

    1-390261-4 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390262-2

    1-390262-2

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    2,625
    RFQ
    1-390262-2

    Datasheet

    1-390262-2 - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole, Right Angle, Vertical Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
    2-641266-1

    2-641266-1

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    3,651
    RFQ
    2-641266-1

    Datasheet

    2-641266-1 Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
    218-7223-55-1902

    218-7223-55-1902

    CONN SOCKET SOIC 18POS GOLD

    3M

    2,380
    RFQ
    218-7223-55-1902

    Datasheet

    218-7223-55-1902 Textool™ Bulk Active SOIC 18 (2 x 9) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    200-6310-9UN-1900

    200-6310-9UN-1900

    CONN SOCKET PGA ZIF 100POS GOLD

    3M

    4,944
    RFQ
    200-6310-9UN-1900

    Datasheet

    200-6310-9UN-1900 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    200-6311-9UN-1900

    200-6311-9UN-1900

    CONN SOCKET PGA ZIF 121POS GOLD

    3M

    3,584
    RFQ
    200-6311-9UN-1900

    Datasheet

    200-6311-9UN-1900 Textool™ Bulk Obsolete PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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