Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSS-B20-043H-01 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	2,951	-	RFQ	Datasheet	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Angled Fins	0.211" (5.35mm)	0.874" (22.20mm)	-	1.250" (31.75mm)	2.9W @ 75°C	8.18°C/W @ 200 LFM	26.13°C/W	Aluminum	Black Anodized
HSS-B20-NP-13 HEATSINK TO-220 3.9W ALUMINUM Same Sky (Formerly CUI Devices)	3,113	-	RFQ	Datasheet	HSS	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	3.9W @ 75°C	5.88°C/W @ 200 LFM	19.22°C/W	Aluminum	Black Anodized
HSS-B20-NP-02 HEATSINK TO-220 3.6W ALUMINUM Same Sky (Formerly CUI Devices)	4,711	-	RFQ	Datasheet	HSS	Bag	Active	Board Level	TO-220	-	Rectangular, Fins	0.748" (19.00mm)	0.830" (21.08mm)	-	0.394" (10.00mm)	3.6W @ 75°C	5.39°C/W @ 200 LFM	20.59°C/W	Aluminum	Black Anodized
V-1101-SMD/A-L STAMPED HEATSINK Assmann WSW Components	3,219	-	RFQ	-	-	Bulk	Active	Top Mount	TO-263	SMD Pad	Rectangular, Fins	0.590" (14.99mm)	1.020" (25.91mm)	-	0.375" (9.52mm)	-	-	15.00°C/W	Copper Alloy	Tin
7019BG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,962	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.000" (25.40mm)	1.550" (39.37mm)	-	0.375" (9.52mm)	3.0W @ 40°C	8.00°C/W @ 100 LFM	11.00°C/W	Aluminum	Black Anodized
825502B03453 HEATSINK STAMP 25.4X12.7X30MM Comair Rotron	3,150	-	RFQ	Datasheet	-	Bulk	Obsolete	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
218-40CT3 HEATSINK ALUM BLACK SMD Wakefield-Vette	4,865	-	RFQ	Datasheet	218	Bulk	Active	Top Mount	SMD	SMD Pad	Rectangular, Fins	0.320" (8.13mm)	0.900" (22.86mm)	-	0.400" (10.16mm)	2.0W @ 62°C	21.00°C/W @ 200 LFM	31.00°C/W	Copper	Tin
V8502A1 STAMPED HEATSINK Assmann WSW Components	3,876	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	1.181" (30.00mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	-	-	20.00°C/W	Aluminum Alloy	Black Anodized
218-40CT5 HEATSINK ALUM NATURAL SMD Wakefield-Vette	2,785	-	RFQ	Datasheet	218	Bulk	Active	Top Mount	SMD	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.030" (26.16mm)	-	0.400" (10.16mm)	2.3W @ 40°C	5.00°C/W @ 600 LFM	31.00°C/W	Copper	Tin
833802T00000 HEATSINK STAMP 13.1X13.2X24MM Comair Rotron	3,294	-	RFQ	Datasheet	-	Bulk	Obsolete	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.848" (21.55mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	0.5W @ 20°C	12.00°C/W @ 500 LFM	-	Copper	Tin
V2018B CPU HEATSINKS Assmann WSW Components	3,118	-	RFQ	-	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.709" (18.00mm)	0.394" (10.00mm)	-	0.394" (10.00mm)	-	-	-	Aluminum Alloy	Black Anodized
V2163B1 STAMPED HEATSINK Assmann WSW Components	3,708	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220, TO-247	PC Pin	Rectangular, Fins	0.929" (23.60mm)	1.929" (49.00mm)	-	0.945" (24.00mm)	-	-	16.00°C/W	Aluminum Alloy	Black Anodized
V5616X-T HEATSINK ALUM ANOD Assmann WSW Components	4,184	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.378" (35.00mm)	0.669" (17.00mm)	-	0.512" (13.00mm)	-	-	17.00°C/W	Aluminum	Black Anodized
HSS21-B20-P53 HEAT SINK, STAMPING, TO-218/TO-2 Same Sky (Formerly CUI Devices)	4,796	-	RFQ	Datasheet	HSS	Box	Active	Board Level	TO-218, TO-220	PC Pin	Rectangular, Fins	1.000" (25.40mm)	0.961" (24.40mm)	-	0.500" (12.70mm)	3.58W @ 75°C	10.10°C/W @ 200 LFM	20.93°C/W	Aluminum Alloy	Black Anodized
HSS-B20-NP-14 HEATSINK TO-220 4.4W ALUMINUM Same Sky (Formerly CUI Devices)	3,432	-	RFQ	Datasheet	HSS	Bag	Active	Top Mount	TO-220	Clip and Board Mounts	Rectangular, Fins	0.375" (9.53mm)	0.985" (25.00mm)	-	0.961" (24.40mm)	4.4W @ 75°C	4.51°C/W @ 200 LFM	17.05°C/W	Aluminum	Black Anodized
375224B00032G 375224B00032G Boyd Laconia, LLC	3,769	-	RFQ	-	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.437" (11.10mm)	0.401" (10.20mm)	-	0.402" (10.21mm)	0.5W @ 40°C	21.20°C/W @ 200 LFM	71.40°C/W	Aluminum	Black Anodized
V2011SN STAMPED HEATSINK, ATTACHABLE, AL Assmann WSW Components	3,552	-	RFQ	Datasheet	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.866" (22.00mm)	0.433" (11.00mm)	-	0.748" (19.00mm)	-	-	21.00°C/W	Aluminum	Tin
V7477X2 HEATSINK ALUM ANOD Assmann WSW Components	4,450	-	RFQ	Datasheet	-	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	PC Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.500" (12.70mm)	-	-	11.00°C/W	Aluminum	Black Anodized
V2025B CPU HEATSINKS Assmann WSW Components	3,597	-	RFQ	-	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.024" (26.00mm)	1.024" (26.00mm)	-	0.500" (12.70mm)	-	-	-	Aluminum Alloy	Black Anodized
V6534A-T STAMPED HEATSINK Assmann WSW Components	2,633	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.787" (20.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	-	-	35.00°C/W	Aluminum Alloy	Clean Finished

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