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    SENICO ELECTRONICS INTL CO., LIMITED

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    Manufacturer Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    290-1AB

    290-1AB

    HEATSINK TO-220 VERT/HORZ BLK

    Wakefield-Vette

    4,488
    RFQ
    290-1AB

    Datasheet

    290-1AB 290 Bulk Active Board Level TO-218, TO-202, TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
    287-1ABE

    287-1ABE

    HEATSINK FOR TO220

    Wakefield-Vette

    3,947
    RFQ
    287-1ABE

    Datasheet

    287-1ABE 287 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
    658-25AB

    658-25AB

    HEATSINK CPU 28MM SQ BLK

    Wakefield-Vette

    10,734
    RFQ
    658-25AB

    Datasheet

    658-25AB 658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    658-60AB

    658-60AB

    HEATSINK CPU 28MM SQ BLK W/OTAPE

    Wakefield-Vette

    133
    RFQ
    658-60AB

    Datasheet

    658-60AB 658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    LTN20069

    LTN20069

    HEAT SINK BGA/PGA 16.5X16.5X8.9

    Wakefield-Vette

    5,849
    RFQ
    LTN20069

    Datasheet

    LTN20069 Penguin Bulk Active Board Level Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) - 0.350" (8.89mm) - 8.00°C/W @ 500 LFM - Aluminum Black Anodized
    637-10ABPE

    637-10ABPE

    HEATSINK TO-220 VERT MT BLK 1"

    Wakefield-Vette

    2,170
    RFQ
    637-10ABPE

    Datasheet

    637-10ABPE 637 Box Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
    657-20ABEP

    657-20ABEP

    HEATSINK TO-220 W/PINS BLK 2"

    Wakefield-Vette

    9,777
    RFQ
    657-20ABEP

    Datasheet

    657-20ABEP 657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM 5.30°C/W Aluminum Black Anodized
    647-15ABPE

    647-15ABPE

    HEATSINK TO-220 W/PINS BLK 1.5"

    Wakefield-Vette

    3,550
    RFQ
    647-15ABPE

    Datasheet

    647-15ABPE 647 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 37°C 3.50°C/W @ 200 LFM - Aluminum Black Anodized
    624-25ABT4E

    624-25ABT4E

    HEATSINK CPU 21MM SQ W/DBL TAPE

    Wakefield-Vette

    1,017
    RFQ
    624-25ABT4E

    Datasheet

    624-25ABT4E 624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
    634-15ABPE

    634-15ABPE

    HEATSINK SLIM VERT BLACK TO-220

    Wakefield-Vette

    2,519
    RFQ
    634-15ABPE

    Datasheet

    634-15ABPE 634 Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 0.640" (16.26mm) - 0.640" (16.26mm) 3.0W @ 50°C 2.00°C/W @ 300 LFM 50.00°C/W Aluminum Black Anodized
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