Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    Heat Sinks

    Manufacturer Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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    Reset All
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    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
    2283B

    2283B

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,074
    RFQ
    2283B

    Datasheet

    2283B - Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.655" (16.64mm) 0.655" (16.64mm) - 0.265" (6.73mm) 1.0W @ 40°C 17.50°C/W @ 300 LFM - Aluminum Black Anodized
    373024B00032G

    373024B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    2,321
    RFQ

    -

    373024B00032G - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
    373024B00034G

    373024B00034G

    BGA HEAT SINK

    Boyd Laconia, LLC

    3,381
    RFQ

    -

    373024B00034G - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
    580100W00000G

    580100W00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,944
    RFQ
    580100W00000G

    Datasheet

    580100W00000G - Bulk Active Top Mount 8-DIP Press Fit, Slide On Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
    374824B00035G

    374824B00035G

    BGA HEAT SINK

    Boyd Laconia, LLC

    3,581
    RFQ
    374824B00035G

    Datasheet

    374824B00035G - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 2.0W @ 30°C 5.00°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
    6400B-P2G

    6400B-P2G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,071
    RFQ
    6400B-P2G

    Datasheet

    6400B-P2G - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W Aluminum Black Anodized
    533302B02551G

    533302B02551G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,612
    RFQ
    533302B02551G

    Datasheet

    533302B02551G - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 60°C 2.00°C/W @ 800 LFM 8.00°C/W Aluminum Black Anodized
    529701B02100G

    529701B02100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,850
    RFQ
    529701B02100G

    Datasheet

    529701B02100G - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
    501000B00000G

    501000B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    4,412
    RFQ
    501000B00000G

    Datasheet

    501000B00000G - Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.604" (15.34mm) - 0.212" (5.39mm) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W Aluminum Black Anodized
    335214B00032G

    335214B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    2,512
    RFQ
    335214B00032G

    Datasheet

    335214B00032G - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.390" (9.91mm) - 5.30°C/W @ 200 LFM 10.00°C/W Aluminum Black Anodized
    550402B00000

    550402B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,320
    RFQ
    550402B00000

    Datasheet

    550402B00000 - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 4.0W @ 40°C 4.00°C/W @ 300 LFM 11.20°C/W Aluminum Black Anodized
    591202B03700G

    591202B03700G

    HEATSINK TO-220 CLIP-ON BLACK

    Boyd Laconia, LLC

    4,067
    RFQ
    591202B03700G

    Datasheet

    591202B03700G - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
    2262R

    2262R

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,373
    RFQ
    2262R

    Datasheet

    2262R - Bulk Active Top Mount TO-5 Bolt On Cylindrical - - 0.318" (8.07mm) ID, 0.602" (15.29mm) OD 0.250" (6.35mm) 1.6W @ 80°C 30.00°C/W @ 200 LFM - Aluminum Red Anodized
    519703B00000G

    519703B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,665
    RFQ
    519703B00000G

    Datasheet

    519703B00000G - Bulk Active Board Level TO-3 Bolt On Rhombus 1.550" (39.37mm) 1.550" (39.37mm) - 1.500" (38.10mm) 6.0W @ 30°C 2.00°C/W @ 400 LFM 4.80°C/W Aluminum Black Anodized
    575400B00000G

    575400B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,205
    RFQ
    575400B00000G

    Datasheet

    575400B00000G - Bulk Active Top Mount TO-92 Press Fit Rectangular, Fins 0.602" (15.29mm) - - 1.220" (31.00mm) 0.5W @ 20°C 20.00°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
    575502B00000G

    575502B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,029
    RFQ
    575502B00000G

    Datasheet

    575502B00000G - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) 1.5W @ 40°C 6.00°C/W @ 400 LFM 24.00°C/W Aluminum Black Anodized
    374524B00032G

    374524B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    3,532
    RFQ

    -

    374524B00032G - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 4.0W @ 70°C 4.00°C/W @ 400 LFM 16.50°C/W Aluminum Black Anodized
    529801B00000

    529801B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    3,573
    RFQ
    529801B00000

    Datasheet

    529801B00000 - Bulk Active Board Level TO-218 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum Black Anodized
    513002B00000

    513002B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    2,268
    RFQ
    513002B00000

    Datasheet

    513002B00000 - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    550102B00000

    550102B00000

    HEATSINK TO-220 TAB BLACK

    Boyd Laconia, LLC

    4,620
    RFQ
    550102B00000

    Datasheet

    550102B00000 - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.40°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 60766077607860796080608160826083...6110Next»
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