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3M SDR-L3

WIRE MARKER L3 LEGEND 1=10 ROLLS

Answer first: this page is a purchasing reference for the exact part number SDR-L3 from 3M. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: 3M Category: Markers Part number: SDR-L3 Package: RFQ verification required

Key Parameters

Part NumberSDR-L3
Manufacturer3M
CategoryMarkers
seriesScotchCodeâ„¢ SDR
packagingBulk
product statusActive
param 1Wire Marker, Tape
param 20.22" W x 96.00" L (5.5mm x 2.4m)
param 3Cut to Desired Diameter
param 4L3
param 5White
param 6Polyester
param 724 Months
param 8Date of Manufacture
param 9-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify SDR-L3 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For SDR-L3, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.