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Alpha Wire FPRINT1/2 YL082

LABEL HEAT SHRINKABLE 0.5"D YLW

Answer first: this page is a purchasing reference for the exact part number FPRINT1/2 YL082 from Alpha Wire. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Alpha Wire Part number: FPRINT1/2 YL082 Package: RFQ verification required

Key Parameters

Part NumberFPRINT1/2 YL082
ManufacturerAlpha Wire
CategoryLabels, Labeling
seriesFIT®-PRINT
packagingRoll
product statusActive
param 1Heat Shrinkable
param 20.50" Dia (12.7mm)
param 3Yellow
param 4Polyolefin (PO), Irradiated
param 5Dot-Matrix Printer
param 6-
param 7-
param 8-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify FPRINT1/2 YL082 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For FPRINT1/2 YL082, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.