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    SENICO ELECTRONICS INTL CO., LIMITED

    AMD XC7Z035-3FBG676E

    Part No.:
    XC7Z035-3FBG676E
    Manufacturer:
    AMD
    Category:
    System On Chip (SoC)
    Package:
    676-BBGA, FCBGA
    Datasheet:
    SENICO ELECTRONICS INTL CO., LIMITEDXC7Z035-3FBG676E.pdf
    Description:
    IC SOC CORTEX-A9 800MHZ 676FCBGA
    Quantity:

    Unit Price:$0

    Ext Price:$0

    Payment:
    Payment
    Shipping:
    Shipping

    Inventory:1,453

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    Product details

    • Specifications
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    Attributes
    Property Value
    Manufacturer:
    AMD
    Series:
    Zynq®-7000
    Package/Case:
    676-BBGA, FCBGA
    Packaging:
    Tray
    Product Status:
    Active
    Architecture:
    MCU, FPGA
    Core Processor:
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Flash Size:
    -
    RAM Size:
    256KB
    Peripherals:
    DMA
    Connectivity:
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed:
    1GHz
    Primary Attributes:
    Kintex™-7 FPGA, 275K Logic Cells
    Operating Temperature:
    0°C ~ 100°C (TJ)
    Grade:
    -
    Qualification:
    -
    Supplier Device Package:
    676-FCBGA (27x27)
    Category:
    System On Chip (SoC)

    1. How can I order XC7Z035-3FBG676E from SENICO ELECTRONICS INTL CO., LIMITED?

    Use the RFQ form to send the exact part number, required quantity and any packaging, date-code or delivery requirements. Review the written quotation and confirm the order terms before purchasing. If online purchasing is available for this item, check the displayed quantity and price before proceeding to checkout.

    2. What sourcing and quality information should I confirm for XC7Z035-3FBG676E?

    Ask which source and traceability documents are available for the offered lot, and specify any inspection or testing requirements in your RFQ. Confirm the agreed evidence and acceptance criteria in writing before ordering; a product listing alone does not establish manufacturer authorization or lot-specific test results.

    3. How should I confirm the price and availability of XC7Z035-3FBG676E?

    Price and available quantity can change. Check the quantity tier and currency of any displayed price, and confirm the current quantity, unit price, lead time and quotation validity before placing an order. An RFQ or Negotiable listing requires a quotation rather than indicating a fixed selling price.

    4. What payment terms apply to my order?

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    5. How should I arrange shipping?

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    6. How can I request a return or replacement of XC7Z035-3FBG676E?

    Contact your sales representative with the order number, part number, quantity and a description of the issue, including photographs where relevant. Check the applicable return conditions and time limits for your order, and obtain return authorization and shipping instructions before sending any goods back.

    7. How can I request the datasheet or technical information for XC7Z035-3FBG676E?

    Use the datasheet link on the product page when available, or contact us with the exact manufacturer and part number. Check the manufacturer's current datasheet and package documentation for electrical limits, pin assignments and application requirements before design-in.

    Image XC7Z035-2FFG900I by AMD, 900-BBGA, FCBGA, SENICO Electronics XC7Z035-1FFG676I by AMD, 676-BBGA, FCBGA, SENICO Electronics XC7Z035-1FBG676C by AMD, 676-BBGA, FCBGA, SENICO Electronics XC7Z035-1FBG676I by AMD, 676-BBGA, FCBGA, SENICO Electronics XC7Z035-1FFG676C by AMD, 676-BBGA, FCBGA, SENICO Electronics
    Part Number XC7Z035-2FFG900I XC7Z035-1FFG676I XC7Z035-1FBG676C XC7Z035-1FBG676I XC7Z035-1FFG676C
    Manufacturer AMD AMD AMD AMD AMD
    Series Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
    Package/Case 900-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
    Packaging Tray Tray Tray Tray Tray
    Product Status Active Active Active Active Active
    Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
    Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    Flash Size - - - - -
    RAM Size 256KB 256KB 256KB 256KB 256KB
    Peripherals DMA DMA DMA DMA DMA
    Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed 800MHz 667MHz 667MHz 667MHz 667MHz
    Primary Attributes Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells Kintex™-7 FPGA, 275K Logic Cells
    Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
    Grade - - - - -
    Qualification - - - - -
    Supplier Device Package 900-FCBGA (31x31) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27)

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