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Panduit Corp TTSL-2

LABEL SELF LAMINATNG 1"X1.5" WHT

Answer first: this page is a purchasing reference for the exact part number TTSL-2 from Panduit Corp. Use it to start datasheet, package, manufacturer and RFQ verification; do not treat page text as a live stock, price or lead-time promise.

Manufacturer: Panduit Corp Part number: TTSL-2 Package: RFQ verification required

Key Parameters

Part NumberTTSL-2
ManufacturerPanduit Corp
CategoryLabels, Labeling
seriesPAN-CODE™
packagingBulk
product statusActive
param 1Self Laminating
param 21" x 1.5" x 0.5" (25.4mm x 38.1mm x 12.7mm)
param 3White
param 4Vinyl
param 5Panduit PTR2E Printer and 8-6 AWG THHN Cable
param 648 Months
param 7-
param 8-

Parameters are provided for purchasing review. Confirm package, suffix, lifecycle status, datasheet revision and approved substitutes before ordering.

How to Verify TTSL-2 Before Ordering

Datasheet and parameter checks

  • Confirm the full manufacturer part number, not only a shortened search keyword.
  • Compare package, pinout, dimensions, voltage or rating fields, temperature range and compliance wording against the released BOM.
  • Use the manufacturer datasheet or drawing for electrical and mechanical limits before approving a substitute.

RFQ fields SENICO needs

  • Send exact part number, manufacturer, quantity, target delivery date, destination and required packaging.
  • State whether alternates are allowed, and list any date-code, certificate, traceability or customer AVL requirement.
  • Keep exact stock, factory lead time and proposed alternatives in separate quote lanes.

For TTSL-2, SENICO recommends checking manufacturer marking, package, date code, requested quantity, approved vendor requirements and replacement risk before issuing a purchase order. If a supplier suggests an equivalent, record the changed fields and approval owner before comparing price.

We do not treat displayed data as a real-time stock or price commitment. The RFQ reply is the verified commercial reference.

Related buying guides: stock and lead-time verification, equivalent IC comparison, and BOM RFQ preparation.