Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    C9108-00

    C9108-00

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,039
    RFQ
    C9108-00

    Datasheet

    C9108-00 Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-0513-10

    14-0513-10

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,342
    RFQ
    14-0513-10

    Datasheet

    14-0513-10 0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-1518-10

    20-1518-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,594
    RFQ
    20-1518-10

    Datasheet

    20-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-87-328-41-134191

    114-87-328-41-134191

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,942
    RFQ
    114-87-328-41-134191

    Datasheet

    114-87-328-41-134191 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-316-41-001101

    612-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,931
    RFQ
    612-83-316-41-001101

    Datasheet

    612-83-316-41-001101 612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-105161

    110-87-324-41-105161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,828
    RFQ
    110-87-324-41-105161

    Datasheet

    110-87-324-41-105161 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-024-050

    110-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    3,347
    RFQ
    110-024-050

    Datasheet

    110-024-050 100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    A-ICS-254-12-TT50

    A-ICS-254-12-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    3,251
    RFQ
    A-ICS-254-12-TT50

    Datasheet

    A-ICS-254-12-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-83-314-41-105191

    110-83-314-41-105191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,215
    RFQ

    -

    110-83-314-41-105191 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-310-41-002101

    124-83-310-41-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,320
    RFQ

    -

    124-83-310-41-002101 124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A48-LCG-T-R

    A48-LCG-T-R

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    4,956
    RFQ
    A48-LCG-T-R

    Datasheet

    A48-LCG-T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    16-3511-10

    16-3511-10

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,824
    RFQ
    16-3511-10

    Datasheet

    16-3511-10 511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    4603

    4603

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    2,250
    RFQ
    4603

    Datasheet

    4603 - Bulk Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    3-822516-7

    3-822516-7

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    3,776
    RFQ
    3-822516-7

    Datasheet

    3-822516-7 - Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    D2922-42

    D2922-42

    CONN IC DIP SOCKET 22POS GOLD

    Harwin Inc.

    4,131
    RFQ
    D2922-42

    Datasheet

    D2922-42 D2 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    299-87-308-11-001101

    299-87-308-11-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,326
    RFQ
    299-87-308-11-001101

    Datasheet

    299-87-308-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-210-41-011101

    116-87-210-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,237
    RFQ
    116-87-210-41-011101

    Datasheet

    116-87-210-41-011101 116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-324-41-006101

    116-87-324-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,211
    RFQ
    116-87-324-41-006101

    Datasheet

    116-87-324-41-006101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-220-10-001101

    410-83-220-10-001101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    4,339
    RFQ
    410-83-220-10-001101

    Datasheet

    410-83-220-10-001101 410 Bulk Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-220-10-002101

    410-83-220-10-002101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    4,066
    RFQ
    410-83-220-10-002101

    Datasheet

    410-83-220-10-002101 410 Bulk Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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