Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 42-HZL/01-TT

    AR 42-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,850
    RFQ

    -

    AR 42-HZL/01-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-316-41-008101

    116-87-316-41-008101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,432
    RFQ
    116-87-316-41-008101

    Datasheet

    116-87-316-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6518-10T

    28-6518-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,610
    RFQ
    28-6518-10T

    Datasheet

    28-6518-10T 518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    5-1437529-9

    5-1437529-9

    CONN IC DIP SOCKET 4POS GOLD

    TE Connectivity AMP Connectors

    2,755
    RFQ

    -

    5-1437529-9 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
    SIP050-1X25-157B

    SIP050-1X25-157B

    1X25-157B-SIP SOCKET 25 CTS

    Amphenol ICC (FCI)

    3,943
    RFQ
    SIP050-1X25-157B

    Datasheet

    SIP050-1X25-157B SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    122-87-318-41-001101

    122-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,450
    RFQ
    122-87-318-41-001101

    Datasheet

    122-87-318-41-001101 122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-318-41-001101

    123-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,420
    RFQ
    123-87-318-41-001101

    Datasheet

    123-87-318-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0103-G-12

    HLS-0103-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,749
    RFQ
    HLS-0103-G-12

    Datasheet

    HLS-0103-G-12 HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    612-87-624-41-001101

    612-87-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,489
    RFQ
    612-87-624-41-001101

    Datasheet

    612-87-624-41-001101 612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-001101

    116-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,196
    RFQ
    116-87-314-41-001101

    Datasheet

    116-87-314-41-001101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0518-11H

    08-0518-11H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,513
    RFQ
    08-0518-11H

    Datasheet

    08-0518-11H 518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-11H

    08-1518-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,977
    RFQ
    08-1518-11H

    Datasheet

    08-1518-11H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-11

    14-1518-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,346
    RFQ
    14-1518-11

    Datasheet

    14-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-10H

    17-0518-10H

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,800
    RFQ
    17-0518-10H

    Datasheet

    17-0518-10H 518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-318-41-105101

    110-83-318-41-105101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,961
    RFQ
    110-83-318-41-105101

    Datasheet

    110-83-318-41-105101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/07-TT

    AR 22-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,408
    RFQ

    -

    AR 22-HZL/07-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-308-STT-L

    ICO-308-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,153
    RFQ
    ICO-308-STT-L

    Datasheet

    ICO-308-STT-L ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-310-41-011101

    116-83-310-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,543
    RFQ
    116-83-310-41-011101

    Datasheet

    116-83-310-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-003101

    116-87-322-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,255
    RFQ
    116-87-322-41-003101

    Datasheet

    116-87-322-41-003101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    122-83-314-41-001101

    122-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,648
    RFQ
    122-83-314-41-001101

    Datasheet

    122-83-314-41-001101 122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 152153154155156157158159...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER