Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-87-324-31-012101

    614-87-324-31-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,673
    RFQ
    614-87-324-31-012101

    Datasheet

    614-87-324-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-STT

    ICO-316-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,636
    RFQ
    ICO-316-STT

    Datasheet

    ICO-316-STT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    SIP050-1X23-160B

    SIP050-1X23-160B

    1X23-160B-SIP SOCKET 23 CTS

    Amphenol ICC (FCI)

    4,161
    RFQ
    SIP050-1X23-160B

    Datasheet

    SIP050-1X23-160B SIP050-1x Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    1-822473-6

    1-822473-6

    CONN SOCKET PLCC 68POS TIN

    TE Connectivity AMP Connectors

    4,899
    RFQ
    1-822473-6

    Datasheet

    1-822473-6 - Box Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -
    08-0513-11H

    08-0513-11H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,010
    RFQ
    08-0513-11H

    Datasheet

    08-0513-11H 0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0513-10H

    11-0513-10H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,354
    RFQ
    11-0513-10H

    Datasheet

    11-0513-10H 0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0204-TT-11

    HLS-0204-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,738
    RFQ
    HLS-0204-TT-11

    Datasheet

    HLS-0204-TT-11 HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    09-0518-00

    09-0518-00

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    4,626
    RFQ
    09-0518-00

    Datasheet

    09-0518-00 518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0202-G-11

    HLS-0202-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,920
    RFQ
    HLS-0202-G-11

    Datasheet

    HLS-0202-G-11 HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    2-1571586-3

    2-1571586-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,719
    RFQ
    2-1571586-3

    Datasheet

    2-1571586-3 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    115-87-636-41-001101

    115-87-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,837
    RFQ

    -

    115-87-636-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-004101

    116-87-610-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,030
    RFQ
    116-87-610-41-004101

    Datasheet

    116-87-610-41-004101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-306-41-013101

    116-83-306-41-013101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,634
    RFQ
    116-83-306-41-013101

    Datasheet

    116-83-306-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-624-41-001101

    115-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,081
    RFQ

    -

    115-83-624-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 22-HZL/01-TT

    AR 22-HZL/01-TT

    SOCKET

    Assmann WSW Components

    3,503
    RFQ

    -

    AR 22-HZL/01-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    08-2511-10

    08-2511-10

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,273
    RFQ
    08-2511-10

    Datasheet

    08-2511-10 511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-0517-90C

    06-0517-90C

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,855
    RFQ
    06-0517-90C

    Datasheet

    06-0517-90C 0517 Bulk Active SIP 6 (1 x 6) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-83-322-41-117101

    114-83-322-41-117101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,455
    RFQ
    114-83-322-41-117101

    Datasheet

    114-83-322-41-117101 114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-624-41-018101

    116-87-624-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,715
    RFQ
    116-87-624-41-018101

    Datasheet

    116-87-624-41-018101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-018101

    116-83-318-41-018101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,204
    RFQ
    116-83-318-41-018101

    Datasheet

    116-83-318-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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