Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    814-AG11D

    814-AG11D

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    4,600
    RFQ
    814-AG11D

    Datasheet

    814-AG11D 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    20-3540-10

    20-3540-10

    COLLET PIN CARRIER 20-PIN .300

    Aries Electronics

    4,528
    RFQ

    -

    20-3540-10 - - Obsolete - - - - - - - - - - - - - - -
    116-87-324-41-018101

    116-87-324-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,839
    RFQ
    116-87-324-41-018101

    Datasheet

    116-87-324-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-318-41-007101

    116-87-318-41-007101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,612
    RFQ
    116-87-318-41-007101

    Datasheet

    116-87-318-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-006101

    116-83-318-41-006101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,543
    RFQ
    116-83-318-41-006101

    Datasheet

    116-83-318-41-006101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-316-41-009101

    116-87-316-41-009101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,879
    RFQ
    116-87-316-41-009101

    Datasheet

    116-87-316-41-009101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    07-0513-11

    07-0513-11

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,765
    RFQ
    07-0513-11

    Datasheet

    07-0513-11 0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    7-1437539-0

    7-1437539-0

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,189
    RFQ
    7-1437539-0

    Datasheet

    7-1437539-0 800 Tube Obsolete DIP, 0.5 to 0.6" Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    116-87-424-41-006101

    116-87-424-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,648
    RFQ
    116-87-424-41-006101

    Datasheet

    116-87-424-41-006101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 48-HZL/01-TT

    AR 48-HZL/01-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    3,676
    RFQ
    AR 48-HZL/01-TT

    Datasheet

    AR 48-HZL/01-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    1571540-1

    1571540-1

    CONN SOCKET PLCC 32POS TIN

    TE Connectivity AMP Connectors

    2,434
    RFQ

    -

    1571540-1 - Bulk Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
    15-0513-10

    15-0513-10

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,141
    RFQ
    15-0513-10

    Datasheet

    15-0513-10 0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-10T

    20-4518-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,402
    RFQ
    20-4518-10T

    Datasheet

    20-4518-10T 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0518-10H

    18-0518-10H

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    4,588
    RFQ
    18-0518-10H

    Datasheet

    18-0518-10H 518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-10H

    18-1518-10H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,733
    RFQ
    18-1518-10H

    Datasheet

    18-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-624-41-001101

    614-87-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,905
    RFQ
    614-87-624-41-001101

    Datasheet

    614-87-624-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-640-41-605101

    110-87-640-41-605101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,324
    RFQ
    110-87-640-41-605101

    Datasheet

    110-87-640-41-605101 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-640-41-005101

    110-87-640-41-005101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,905
    RFQ
    110-87-640-41-005101

    Datasheet

    110-87-640-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-044-12-071101

    510-87-044-12-071101

    CONN SOCKET PGA 44POS GOLD

    Preci-Dip

    4,554
    RFQ
    510-87-044-12-071101

    Datasheet

    510-87-044-12-071101 510 Bulk Active PGA 44 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-324-41-001101

    115-83-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,054
    RFQ

    -

    115-83-324-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 155156157158159160161162...955Next»
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