Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-83-316-41-012101

    116-83-316-41-012101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,364
    RFQ
    116-83-316-41-012101

    Datasheet

    116-83-316-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-10T

    18-0513-10T

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,843
    RFQ
    18-0513-10T

    Datasheet

    18-0513-10T 0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0503-21

    03-0503-21

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,124
    RFQ
    03-0503-21

    Datasheet

    03-0503-21 0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    03-0503-31

    03-0503-31

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,086
    RFQ
    03-0503-31

    Datasheet

    03-0503-31 0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-4518-10T

    22-4518-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,061
    RFQ
    22-4518-10T

    Datasheet

    22-4518-10T 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    212-1-14-003

    212-1-14-003

    CONN IC DIP SOCKET 14POS GOLD

    CNC Tech

    3,049
    RFQ
    212-1-14-003

    Datasheet

    212-1-14-003 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0203-T-10

    HLS-0203-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,060
    RFQ
    HLS-0203-T-10

    Datasheet

    HLS-0203-T-10 HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-83-628-41-001101

    110-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,152
    RFQ
    110-83-628-41-001101

    Datasheet

    110-83-628-41-001101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-628-41-001151

    110-83-628-41-001151

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,582
    RFQ

    -

    110-83-628-41-001151 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-822473-7

    1-822473-7

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    2,454
    RFQ
    1-822473-7

    Datasheet

    1-822473-7 - Box Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    400-028-050

    400-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    2,520
    RFQ
    400-028-050

    Datasheet

    400-028-050 400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    06-6513-11

    06-6513-11

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,241
    RFQ
    06-6513-11

    Datasheet

    06-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0518-11

    12-0518-11

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,643
    RFQ
    12-0518-11

    Datasheet

    12-0518-11 518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-11

    12-1518-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,493
    RFQ
    12-1518-11

    Datasheet

    12-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    D0924-42

    D0924-42

    CONN IC DIP SOCKET 24POS GOLD

    Harwin Inc.

    4,535
    RFQ
    D0924-42

    Datasheet

    D0924-42 D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    822-AG11D-ESL-LF

    822-AG11D-ESL-LF

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    4,199
    RFQ
    822-AG11D-ESL-LF

    Datasheet

    822-AG11D-ESL-LF 800 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-87-316-41-001101

    116-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,391
    RFQ
    116-87-316-41-001101

    Datasheet

    116-87-316-41-001101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-310-41-004101

    116-83-310-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,356
    RFQ
    116-83-310-41-004101

    Datasheet

    116-83-310-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-ICS-254-14-TT50

    A-ICS-254-14-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,608
    RFQ
    A-ICS-254-14-TT50

    Datasheet

    A-ICS-254-14-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-87-322-41-012101

    116-87-322-41-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,971
    RFQ
    116-87-322-41-012101

    Datasheet

    116-87-322-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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