Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-424-41-003101

    116-87-424-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,015
    RFQ
    116-87-424-41-003101

    Datasheet

    116-87-424-41-003101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-3511-10WR

    16-3511-10WR

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    4,217
    RFQ
    16-3511-10WR

    Datasheet

    16-3511-10WR 511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    SIP050-1X25-160B

    SIP050-1X25-160B

    1X25-160B-SIP SOCKET 25 CTS

    Amphenol ICC (FCI)

    4,043
    RFQ
    SIP050-1X25-160B

    Datasheet

    SIP050-1X25-160B SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    121-83-316-41-001101

    121-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,566
    RFQ
    121-83-316-41-001101

    Datasheet

    121-83-316-41-001101 121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X32-157B

    SIP050-1X32-157B

    1X32-157B-SIP SOCKET 32 CTS

    Amphenol ICC (FCI)

    4,696
    RFQ
    SIP050-1X32-157B

    Datasheet

    SIP050-1X32-157B SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-318-41-009101

    116-87-318-41-009101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,787
    RFQ
    116-87-318-41-009101

    Datasheet

    116-87-318-41-009101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C8114-04

    C8114-04

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,845
    RFQ
    C8114-04

    Datasheet

    C8114-04 Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-4513-10H

    08-4513-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,864
    RFQ
    08-4513-10H

    Datasheet

    08-4513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2513-11

    10-2513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,785
    RFQ
    10-2513-11

    Datasheet

    10-2513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-10

    17-0513-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,336
    RFQ
    17-0513-10

    Datasheet

    17-0513-10 0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-10T

    22-0518-10T

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,325
    RFQ
    22-0518-10T

    Datasheet

    22-0518-10T 518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-10

    24-0518-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,614
    RFQ
    24-0518-10

    Datasheet

    24-0518-10 518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-320-41-105161

    110-83-320-41-105161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,096
    RFQ
    110-83-320-41-105161

    Datasheet

    110-83-320-41-105161 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-624-41-005101

    117-83-624-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,637
    RFQ
    117-83-624-41-005101

    Datasheet

    117-83-624-41-005101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 50-HZL/01-TT

    AR 50-HZL/01-TT

    SOCKET

    Assmann WSW Components

    2,900
    RFQ

    -

    AR 50-HZL/01-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICA-308-ZSST

    ICA-308-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,586
    RFQ
    ICA-308-ZSST

    Datasheet

    ICA-308-ZSST ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    124-83-312-41-002101

    124-83-312-41-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,231
    RFQ

    -

    124-83-312-41-002101 124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0513-11

    08-0513-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    3,396
    RFQ
    08-0513-11

    Datasheet

    08-0513-11 0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-314-41-009101

    116-83-314-41-009101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,286
    RFQ
    116-83-314-41-009101

    Datasheet

    116-83-314-41-009101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-420-41-001101

    612-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,241
    RFQ
    612-83-420-41-001101

    Datasheet

    612-83-420-41-001101 612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 166167168169170171172173...955Next»
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