Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    3-1437535-4

    3-1437535-4

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    2,041
    RFQ
    3-1437535-4

    Datasheet

    3-1437535-4 500 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
    115-83-428-41-001101

    115-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,320
    RFQ

    -

    115-83-428-41-001101 115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X31-157B

    SIP050-1X31-157B

    1X31-157B-SIP SOCKET 31 CTS

    Amphenol ICC (FCI)

    4,477
    RFQ
    SIP050-1X31-157B

    Datasheet

    SIP050-1X31-157B SIP050-1x Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AR 24-HZL/07/7-TT

    AR 24-HZL/07/7-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,427
    RFQ
    AR 24-HZL/07/7-TT

    Datasheet

    AR 24-HZL/07/7-TT - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    117-83-428-41-005101

    117-83-428-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,706
    RFQ
    117-83-428-41-005101

    Datasheet

    117-83-428-41-005101 117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-320-41-035101

    146-87-320-41-035101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,246
    RFQ
    146-87-320-41-035101

    Datasheet

    146-87-320-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-320-41-036101

    146-87-320-41-036101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,111
    RFQ
    146-87-320-41-036101

    Datasheet

    146-87-320-41-036101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-628-41-001101

    614-87-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,817
    RFQ
    614-87-628-41-001101

    Datasheet

    614-87-628-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-10

    18-0513-10

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    4,751
    RFQ
    18-0513-10

    Datasheet

    18-0513-10 0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-0518-11H

    10-0518-11H

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,307
    RFQ
    10-0518-11H

    Datasheet

    10-0518-11H 518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-1518-11H

    10-1518-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,283
    RFQ
    10-1518-11H

    Datasheet

    10-1518-11H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0104-T-32

    HLS-0104-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,489
    RFQ
    HLS-0104-T-32

    Datasheet

    HLS-0104-T-32 HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-83-628-41-005101

    117-83-628-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,597
    RFQ
    117-83-628-41-005101

    Datasheet

    117-83-628-41-005101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-52LCC-N-TR

    SMPX-52LCC-N-TR

    SMT PLCC 52P NON POLARISED, T&R

    Kycon, Inc.

    2,521
    RFQ
    SMPX-52LCC-N-TR

    Datasheet

    SMPX-52LCC-N-TR SMPX Tape & Reel (TR) Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    110-83-314-41-801101

    110-83-314-41-801101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,810
    RFQ
    110-83-314-41-801101

    Datasheet

    110-83-314-41-801101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3513-11H

    06-3513-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,488
    RFQ
    06-3513-11H

    Datasheet

    06-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICF-314-TL-O-TR

    ICF-314-TL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,012
    RFQ
    ICF-314-TL-O-TR

    Datasheet

    ICF-314-TL-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-3511-10

    08-3511-10

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,597
    RFQ
    08-3511-10

    Datasheet

    08-3511-10 511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-1518-10T

    18-1518-10T

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,944
    RFQ
    18-1518-10T

    Datasheet

    18-1518-10T 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-00

    11-0518-00

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,933
    RFQ
    11-0518-00

    Datasheet

    11-0518-00 518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 172173174175176177178179...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER