Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    05-0503-20

    05-0503-20

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,652
    RFQ
    05-0503-20

    Datasheet

    05-0503-20 0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    05-0503-30

    05-0503-30

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,319
    RFQ
    05-0503-30

    Datasheet

    05-0503-30 0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0518-00

    12-0518-00

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,637
    RFQ
    12-0518-00

    Datasheet

    12-0518-00 518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    17-0518-11

    17-0518-11

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,232
    RFQ
    17-0518-11

    Datasheet

    17-0518-11 518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    21-0518-10H

    21-0518-10H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,248
    RFQ
    21-0518-10H

    Datasheet

    21-0518-10H 518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0508-20

    06-0508-20

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,543
    RFQ
    06-0508-20

    Datasheet

    06-0508-20 508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-0508-30

    06-0508-30

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,974
    RFQ
    06-0508-30

    Datasheet

    06-0508-30 508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-20

    06-1508-20

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,241
    RFQ
    06-1508-20

    Datasheet

    06-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    06-1508-30

    06-1508-30

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,281
    RFQ
    06-1508-30

    Datasheet

    06-1508-30 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-83-420-41-006101

    116-83-420-41-006101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,679
    RFQ
    116-83-420-41-006101

    Datasheet

    116-83-420-41-006101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-328-41-005101

    110-83-328-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,555
    RFQ
    110-83-328-41-005101

    Datasheet

    110-83-328-41-005101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-640-41-001101

    115-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,739
    RFQ

    -

    115-87-640-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-002101

    116-87-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,030
    RFQ
    116-87-320-41-002101

    Datasheet

    116-87-320-41-002101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-308-F-O

    ICF-308-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,932
    RFQ
    ICF-308-F-O

    Datasheet

    ICF-308-F-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-308-F-I

    ICF-308-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,572
    RFQ
    ICF-308-F-I

    Datasheet

    ICF-308-F-I ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    114-83-424-41-117101

    114-83-424-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,064
    RFQ
    114-83-424-41-117101

    Datasheet

    114-83-424-41-117101 114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-T-10

    HLS-0106-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,603
    RFQ
    HLS-0106-T-10

    Datasheet

    HLS-0106-T-10 HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-318-41-002101

    116-87-318-41-002101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,821
    RFQ
    116-87-318-41-002101

    Datasheet

    116-87-318-41-002101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-316-41-007101

    116-83-316-41-007101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,299
    RFQ
    116-83-316-41-007101

    Datasheet

    116-83-316-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-428-41-005101

    110-83-428-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,029
    RFQ
    110-83-428-41-005101

    Datasheet

    110-83-428-41-005101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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