Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-83-316-41-008101

    116-83-316-41-008101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,359
    RFQ
    116-83-316-41-008101

    Datasheet

    116-83-316-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0105-T-19

    HLS-0105-T-19

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,888
    RFQ
    HLS-0105-T-19

    Datasheet

    HLS-0105-T-19 HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-428-41-018101

    116-87-428-41-018101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,363
    RFQ
    116-87-428-41-018101

    Datasheet

    116-87-428-41-018101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-316-41-035101

    146-83-316-41-035101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,151
    RFQ
    146-83-316-41-035101

    Datasheet

    146-83-316-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-316-41-036101

    146-83-316-41-036101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,664
    RFQ
    146-83-316-41-036101

    Datasheet

    146-83-316-41-036101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-NTT

    ICO-308-NTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,869
    RFQ
    ICO-308-NTT

    Datasheet

    ICO-308-NTT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    14-6513-10

    14-6513-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,355
    RFQ
    14-6513-10

    Datasheet

    14-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-0518-11

    18-0518-11

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,165
    RFQ
    18-0518-11

    Datasheet

    18-0518-11 518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0107-T-2

    HLS-0107-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,758
    RFQ
    HLS-0107-T-2

    Datasheet

    HLS-0107-T-2 HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-87-432-41-105101

    110-87-432-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,298
    RFQ
    110-87-432-41-105101

    Datasheet

    110-87-432-41-105101 110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-318-T-I-TR

    ICF-318-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,216
    RFQ

    -

    ICF-318-T-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-T-O-TR

    ICF-318-T-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,184
    RFQ
    ICF-318-T-O-TR

    Datasheet

    ICF-318-T-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICO-314-LTT

    ICO-314-LTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,271
    RFQ
    ICO-314-LTT

    Datasheet

    ICO-314-LTT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    122-83-318-41-001101

    122-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,804
    RFQ
    122-83-318-41-001101

    Datasheet

    122-83-318-41-001101 122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-318-41-001101

    123-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,206
    RFQ
    123-83-318-41-001101

    Datasheet

    123-83-318-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-004101

    116-87-314-41-004101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,619
    RFQ
    116-87-314-41-004101

    Datasheet

    116-87-314-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-640-41-117101

    114-87-640-41-117101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,476
    RFQ
    114-87-640-41-117101

    Datasheet

    114-87-640-41-117101 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-640-41-134161

    114-87-640-41-134161

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,522
    RFQ
    114-87-640-41-134161

    Datasheet

    114-87-640-41-134161 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-2513-10H

    06-2513-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,186
    RFQ
    06-2513-10H

    Datasheet

    06-2513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3513-11

    12-3513-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,364
    RFQ
    12-3513-11

    Datasheet

    12-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 176177178179180181182183...955Next»
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