Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-87-636-41-105101

    110-87-636-41-105101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,135
    RFQ
    110-87-636-41-105101

    Datasheet

    110-87-636-41-105101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-210-41-004101

    116-83-210-41-004101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,588
    RFQ
    116-83-210-41-004101

    Datasheet

    116-83-210-41-004101 116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-013101

    116-87-610-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,537
    RFQ
    116-87-610-41-013101

    Datasheet

    116-87-610-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-648-41-005101

    117-87-648-41-005101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,917
    RFQ
    117-87-648-41-005101

    Datasheet

    117-87-648-41-005101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1437542-0

    1-1437542-0

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,975
    RFQ
    1-1437542-0

    Datasheet

    1-1437542-0 700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    110-87-314-41-105191

    110-87-314-41-105191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,127
    RFQ

    -

    110-87-314-41-105191 110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0104-G-32

    HLS-0104-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,706
    RFQ
    HLS-0104-G-32

    Datasheet

    HLS-0104-G-32 HLS Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    614-87-636-41-001101

    614-87-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,148
    RFQ
    614-87-636-41-001101

    Datasheet

    614-87-636-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-320-41-001101

    116-87-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,622
    RFQ
    116-87-320-41-001101

    Datasheet

    116-87-320-41-001101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    528-AG11D-ES

    528-AG11D-ES

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,668
    RFQ
    528-AG11D-ES

    Datasheet

    528-AG11D-ES 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    116-87-318-41-011101

    116-87-318-41-011101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,475
    RFQ
    116-87-318-41-011101

    Datasheet

    116-87-318-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WTT-3

    ICA-308-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,370
    RFQ
    ICA-308-WTT-3

    Datasheet

    ICA-308-WTT-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-624-41-006101

    116-83-624-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,424
    RFQ
    116-83-624-41-006101

    Datasheet

    116-83-624-41-006101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    500-032-050

    500-032-050

    CONN SOCKET SIP 32POS GOLD

    3M

    3,010
    RFQ
    500-032-050

    Datasheet

    500-032-050 - Box Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    110-83-632-41-005101

    110-83-632-41-005101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,778
    RFQ
    110-83-632-41-005101

    Datasheet

    110-83-632-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-605101

    110-83-632-41-605101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,859
    RFQ
    110-83-632-41-605101

    Datasheet

    110-83-632-41-605101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-88-084-24-008

    540-88-084-24-008

    CONN SOCKET PLCC 84POS TIN

    Preci-Dip

    3,961
    RFQ
    540-88-084-24-008

    Datasheet

    540-88-084-24-008 540 Bulk Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    21-0513-10

    21-0513-10

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,230
    RFQ
    21-0513-10

    Datasheet

    21-0513-10 0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0513-11H

    11-0513-11H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,267
    RFQ
    11-0513-11H

    Datasheet

    11-0513-11H 0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10T

    23-0513-10T

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    2,645
    RFQ
    23-0513-10T

    Datasheet

    23-0513-10T 0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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