Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-0513-11

    16-0513-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,972
    RFQ
    16-0513-11

    Datasheet

    16-0513-11 0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-0503-20

    06-0503-20

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,757
    RFQ
    06-0503-20

    Datasheet

    06-0503-20 0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    06-0503-30

    06-0503-30

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,869
    RFQ
    06-0503-30

    Datasheet

    06-0503-30 0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-3518-00

    18-3518-00

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,078
    RFQ
    18-3518-00

    Datasheet

    18-3518-00 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    15-0518-00

    15-0518-00

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,779
    RFQ
    15-0518-00

    Datasheet

    15-0518-00 518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    2-1814640-5

    2-1814640-5

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,662
    RFQ
    2-1814640-5

    Datasheet

    2-1814640-5 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    212-1-18-003

    212-1-18-003

    CONN IC DIP SOCKET 18POS GOLD

    CNC Tech

    2,973
    RFQ
    212-1-18-003

    Datasheet

    212-1-18-003 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    SIP050-1X32-160B

    SIP050-1X32-160B

    1X32-160B-SIP SOCKET 32 CTS

    Amphenol ICC (FCI)

    4,876
    RFQ
    SIP050-1X32-160B

    Datasheet

    SIP050-1X32-160B SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-83-420-41-012101

    116-83-420-41-012101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,466
    RFQ
    116-83-420-41-012101

    Datasheet

    116-83-420-41-012101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-008101

    116-83-318-41-008101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,701
    RFQ
    116-83-318-41-008101

    Datasheet

    116-83-318-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-318-41-035101

    146-83-318-41-035101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,103
    RFQ
    146-83-318-41-035101

    Datasheet

    146-83-318-41-035101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-318-41-036101

    146-83-318-41-036101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,416
    RFQ
    146-83-318-41-036101

    Datasheet

    146-83-318-41-036101 146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-43-107-41-013000

    346-43-107-41-013000

    CONN SOCKET SIP 7POS GOLD

    Mill-Max Manufacturing Corp.

    4,770
    RFQ
    346-43-107-41-013000

    Datasheet

    346-43-107-41-013000 346 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-308-T-M

    APA-308-T-M

    ADAPTER PLUG

    Samtec Inc.

    2,603
    RFQ
    APA-308-T-M

    Datasheet

    APA-308-T-M APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    510-87-064-10-051101

    510-87-064-10-051101

    CONN SOCKET PGA 64POS GOLD

    Preci-Dip

    2,705
    RFQ
    510-87-064-10-051101

    Datasheet

    510-87-064-10-051101 510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-424-41-006101

    116-83-424-41-006101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,712
    RFQ
    116-83-424-41-006101

    Datasheet

    116-83-424-41-006101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    824-AG11D-ES

    824-AG11D-ES

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,450
    RFQ
    824-AG11D-ES

    Datasheet

    824-AG11D-ES 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    540-44-052-17-400000

    540-44-052-17-400000

    CONN SOCKET PLCC 52POS TIN

    Mill-Max Manufacturing Corp.

    2,110
    RFQ
    540-44-052-17-400000

    Datasheet

    540-44-052-17-400000 540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    122-83-420-41-001101

    122-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,201
    RFQ
    122-83-420-41-001101

    Datasheet

    122-83-420-41-001101 122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-420-41-001101

    123-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,678
    RFQ
    123-83-420-41-001101

    Datasheet

    123-83-420-41-001101 123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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