Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-83-428-31-012101

    614-83-428-31-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,900
    RFQ
    614-83-428-31-012101

    Datasheet

    614-83-428-31-012101 614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-640-41-105101

    110-87-640-41-105101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,281
    RFQ
    110-87-640-41-105101

    Datasheet

    110-87-640-41-105101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    516-AG12D-LF

    516-AG12D-LF

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    4,706
    RFQ
    516-AG12D-LF

    Datasheet

    516-AG12D-LF 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    121-83-324-41-001101

    121-83-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,688
    RFQ
    121-83-324-41-001101

    Datasheet

    121-83-324-41-001101 121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-C280-10

    14-C280-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,319
    RFQ
    14-C280-10

    Datasheet

    14-C280-10 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-6503-20

    06-6503-20

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,532
    RFQ
    06-6503-20

    Datasheet

    06-6503-20 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-6503-30

    06-6503-30

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,705
    RFQ
    06-6503-30

    Datasheet

    06-6503-30 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-1518-10T

    34-1518-10T

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,926
    RFQ
    34-1518-10T

    Datasheet

    34-1518-10T 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    37-0518-10

    37-0518-10

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,517
    RFQ
    37-0518-10

    Datasheet

    37-0518-10 518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    09-0508-20

    09-0508-20

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,806
    RFQ
    09-0508-20

    Datasheet

    09-0508-20 508 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    09-0508-30

    09-0508-30

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,481
    RFQ
    09-0508-30

    Datasheet

    09-0508-30 508 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    14-C195-10

    14-C195-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,986
    RFQ
    14-C195-10

    Datasheet

    14-C195-10 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-87-642-41-001101

    612-87-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,489
    RFQ
    612-87-642-41-001101

    Datasheet

    612-87-642-41-001101 612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 24-HZW/TN

    AR 24-HZW/TN

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    2,485
    RFQ
    AR 24-HZW/TN

    Datasheet

    AR 24-HZW/TN - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    116-87-428-41-008101

    116-87-428-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,958
    RFQ
    116-87-428-41-008101

    Datasheet

    116-87-428-41-008101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    27-0518-10

    27-0518-10

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    2,335
    RFQ
    27-0518-10

    Datasheet

    27-0518-10 518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-83-628-31-012101

    614-83-628-31-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,798
    RFQ
    614-83-628-31-012101

    Datasheet

    614-83-628-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-428-41-018101

    116-83-428-41-018101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,989
    RFQ
    116-83-428-41-018101

    Datasheet

    116-83-428-41-018101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-318-41-002101

    124-83-318-41-002101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,552
    RFQ

    -

    124-83-318-41-002101 124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-1437535-1

    3-1437535-1

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    3,790
    RFQ

    -

    3-1437535-1 - Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 211212213214215216217218...955Next»
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