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    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-636-41-003101

    116-87-636-41-003101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,264
    RFQ
    116-87-636-41-003101

    Datasheet

    116-87-636-41-003101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-4518-10T

    24-4518-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,973
    RFQ
    24-4518-10T

    Datasheet

    24-4518-10T 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-424-41-001101

    116-87-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,072
    RFQ
    116-87-424-41-001101

    Datasheet

    116-87-424-41-001101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-628-41-035101

    146-87-628-41-035101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,439
    RFQ
    146-87-628-41-035101

    Datasheet

    146-87-628-41-035101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-008101

    116-87-328-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,980
    RFQ
    116-87-328-41-008101

    Datasheet

    116-87-328-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-424-41-012101

    116-83-424-41-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,586
    RFQ
    116-83-424-41-012101

    Datasheet

    116-83-424-41-012101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-652-41-001101

    115-87-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,988
    RFQ

    -

    115-87-652-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-636-41-003101

    115-83-636-41-003101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,183
    RFQ
    115-83-636-41-003101

    Datasheet

    115-83-636-41-003101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1814640-6

    2-1814640-6

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    2,949
    RFQ
    2-1814640-6

    Datasheet

    2-1814640-6 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    24-6513-10

    24-6513-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,198
    RFQ
    24-6513-10

    Datasheet

    24-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81000-10WR

    14-81000-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,141
    RFQ
    14-81000-10WR

    Datasheet

    14-81000-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81100-10WR

    14-81100-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,111
    RFQ
    14-81100-10WR

    Datasheet

    14-81100-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81187-10WR

    14-81187-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,132
    RFQ
    14-81187-10WR

    Datasheet

    14-81187-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-81250-10WR

    14-81250-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,327
    RFQ
    14-81250-10WR

    Datasheet

    14-81250-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8260-10WR

    14-8260-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,239
    RFQ
    14-8260-10WR

    Datasheet

    14-8260-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8350-10WR

    14-8350-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,213
    RFQ
    14-8350-10WR

    Datasheet

    14-8350-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8400-10WR

    14-8400-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,350
    RFQ
    14-8400-10WR

    Datasheet

    14-8400-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8435-10WR

    14-8435-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,112
    RFQ
    14-8435-10WR

    Datasheet

    14-8435-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8470-10WR

    14-8470-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,505
    RFQ
    14-8470-10WR

    Datasheet

    14-8470-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8510-10WR

    14-8510-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,191
    RFQ
    14-8510-10WR

    Datasheet

    14-8510-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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