Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICF-624-TL-I-TR

    ICF-624-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,798
    RFQ
    ICF-624-TL-I-TR

    Datasheet

    ICF-624-TL-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-420-41-011101

    116-87-420-41-011101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,072
    RFQ
    116-87-420-41-011101

    Datasheet

    116-87-420-41-011101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-007101

    116-83-324-41-007101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,962
    RFQ
    116-83-324-41-007101

    Datasheet

    116-83-324-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-008101

    116-87-628-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,597
    RFQ
    116-87-628-41-008101

    Datasheet

    116-87-628-41-008101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-640-41-018101

    116-87-640-41-018101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,095
    RFQ
    116-87-640-41-018101

    Datasheet

    116-87-640-41-018101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-316-TL-O

    ICF-316-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,685
    RFQ
    ICF-316-TL-O

    Datasheet

    ICF-316-TL-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0303-G-2

    HLS-0303-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,142
    RFQ
    HLS-0303-G-2

    Datasheet

    HLS-0303-G-2 HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    818-AG11D

    818-AG11D

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    4,654
    RFQ
    818-AG11D

    Datasheet

    818-AG11D 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    HLS-0207-S-2

    HLS-0207-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,848
    RFQ
    HLS-0207-S-2

    Datasheet

    HLS-0207-S-2 HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0107-T-32

    HLS-0107-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,274
    RFQ
    HLS-0107-T-32

    Datasheet

    HLS-0107-T-32 HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-316-41-004101

    116-83-316-41-004101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,827
    RFQ
    116-83-316-41-004101

    Datasheet

    116-83-316-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-001101

    116-83-320-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,313
    RFQ
    116-83-320-41-001101

    Datasheet

    116-83-320-41-001101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3513-11

    14-3513-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,084
    RFQ
    14-3513-11

    Datasheet

    14-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6513-11

    12-6513-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,481
    RFQ
    12-6513-11

    Datasheet

    12-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4513-10T

    22-4513-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,151
    RFQ
    22-4513-10T

    Datasheet

    22-4513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-1518-00

    14-1518-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,315
    RFQ
    14-1518-00

    Datasheet

    14-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3518-10H

    14-3518-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,121
    RFQ
    14-3518-10H

    Datasheet

    14-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-9513-10T

    20-9513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,657
    RFQ
    20-9513-10T

    Datasheet

    20-9513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-3513-10T

    26-3513-10T

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,925
    RFQ
    26-3513-10T

    Datasheet

    26-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-0503-31

    05-0503-31

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,651
    RFQ
    05-0503-31

    Datasheet

    05-0503-31 0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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