Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    38-0518-10

    38-0518-10

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    4,051
    RFQ
    38-0518-10

    Datasheet

    38-0518-10 518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-0518-10T

    40-0518-10T

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    4,161
    RFQ
    40-0518-10T

    Datasheet

    40-0518-10T 518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    122-83-624-41-001101

    122-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,652
    RFQ
    122-83-624-41-001101

    Datasheet

    122-83-624-41-001101 122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-624-41-001101

    123-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,776
    RFQ
    123-83-624-41-001101

    Datasheet

    123-83-624-41-001101 123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-SST

    ICO-314-SST

    CONN IC DIP SOCKET 14POS GOLD

    Samtec Inc.

    2,924
    RFQ
    ICO-314-SST

    Datasheet

    ICO-314-SST ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-TT-10

    HLS-0207-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,290
    RFQ
    HLS-0207-TT-10

    Datasheet

    HLS-0207-TT-10 HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICO-422-STT-L

    ICO-422-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,681
    RFQ
    ICO-422-STT-L

    Datasheet

    ICO-422-STT-L ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-628-41-003101

    116-83-628-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,537
    RFQ
    116-83-628-41-003101

    Datasheet

    116-83-628-41-003101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-0518-10

    28-0518-10

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    2,637
    RFQ
    28-0518-10

    Datasheet

    28-0518-10 518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-1518-10

    28-1518-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,576
    RFQ
    28-1518-10

    Datasheet

    28-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0208-TT-11

    HLS-0208-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,971
    RFQ
    HLS-0208-TT-11

    Datasheet

    HLS-0208-TT-11 HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-314-SST-L

    ICA-314-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,126
    RFQ
    ICA-314-SST-L

    Datasheet

    ICA-314-SST-L ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-012101

    116-83-324-41-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,717
    RFQ
    116-83-324-41-012101

    Datasheet

    116-83-324-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3518-10H

    20-3518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,207
    RFQ
    20-3518-10H

    Datasheet

    20-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1-1437537-1

    1-1437537-1

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,884
    RFQ
    1-1437537-1

    Datasheet

    1-1437537-1 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic -55°C ~ 125°C
    08-2501-30

    08-2501-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,797
    RFQ
    08-2501-30

    Datasheet

    08-2501-30 501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2513-11H

    10-2513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,332
    RFQ
    10-2513-11H

    Datasheet

    10-2513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-11

    17-0513-11

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,271
    RFQ
    17-0513-11

    Datasheet

    17-0513-11 0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-3518-01

    08-3518-01

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,357
    RFQ
    08-3518-01

    Datasheet

    08-3518-01 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-624-STL-I-TR

    ICF-624-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,974
    RFQ
    ICF-624-STL-I-TR

    Datasheet

    ICF-624-STL-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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