Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    A-ICS-254-24-TT50

    A-ICS-254-24-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,434
    RFQ
    A-ICS-254-24-TT50

    Datasheet

    A-ICS-254-24-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    38-0518-10T

    38-0518-10T

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,249
    RFQ
    38-0518-10T

    Datasheet

    38-0518-10T 518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10T

    38-1518-10T

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,942
    RFQ
    38-1518-10T

    Datasheet

    38-1518-10T 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3518-11

    18-3518-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,966
    RFQ
    18-3518-11

    Datasheet

    18-3518-11 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-424-41-008101

    116-83-424-41-008101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,002
    RFQ
    116-83-424-41-008101

    Datasheet

    116-83-424-41-008101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0114-TT-10

    HLS-0114-TT-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,110
    RFQ
    HLS-0114-TT-10

    Datasheet

    HLS-0114-TT-10 HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    116-87-432-41-002101

    116-87-432-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,548
    RFQ
    116-87-432-41-002101

    Datasheet

    116-87-432-41-002101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-SST-L

    ICA-316-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,409
    RFQ
    ICA-316-SST-L

    Datasheet

    ICA-316-SST-L ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    1571994-8

    1571994-8

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    4,399
    RFQ
    1571994-8

    Datasheet

    1571994-8 510 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    124-83-320-41-002101

    124-83-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,770
    RFQ

    -

    124-83-320-41-002101 124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1571586-6

    2-1571586-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    3,654
    RFQ
    2-1571586-6

    Datasheet

    2-1571586-6 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    116-87-424-41-011101

    116-87-424-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,959
    RFQ
    116-87-424-41-011101

    Datasheet

    116-87-424-41-011101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-013101

    116-83-312-41-013101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,835
    RFQ
    116-83-312-41-013101

    Datasheet

    116-83-312-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-2501-20

    10-2501-20

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,297
    RFQ
    10-2501-20

    Datasheet

    10-2501-20 501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2501-30

    10-2501-30

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    2,978
    RFQ
    10-2501-30

    Datasheet

    10-2501-30 501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    21-0513-10H

    21-0513-10H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,999
    RFQ
    21-0513-10H

    Datasheet

    21-0513-10H 0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    6-1437535-3

    6-1437535-3

    CONN SOCKET SIP 8POS GOLD

    TE Connectivity AMP Connectors

    4,060
    RFQ
    6-1437535-3

    Datasheet

    6-1437535-3 500 Tube Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Thermoplastic -
    299-87-316-11-001101

    299-87-316-11-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,305
    RFQ
    299-87-316-11-001101

    Datasheet

    299-87-316-11-001101 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-CTT

    ICO-314-CTT

    CONN IC DIP SOCKET 14POS TIN

    Samtec Inc.

    2,343
    RFQ
    ICO-314-CTT

    Datasheet

    ICO-314-CTT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    117-87-640-41-105101

    117-87-640-41-105101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,801
    RFQ
    117-87-640-41-105101

    Datasheet

    117-87-640-41-105101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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